ATS-01D-13-C2-R0 Utu (USD) [14543Stock Ngahau]
- 1 pcs$2.83370
- 10 pcs$2.61335
- 30 pcs$2.46822
- 50 pcs$2.32311
- 100 pcs$2.17790
- 250 pcs$2.03270
- 500 pcs$1.88751
- 1,000 pcs$1.85121
- Te waahanga waahanga:
- ATS-01D-13-C2-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- HEATSINK 50X50X15MM XCUT T766.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te wera - Hoko te werawera, Te Raumati - Thermoelectric, Peltier Assemblies, Te Werawera - Meaa, Te Werawera - Thermoelectric, Peltier Modules, Ahua AC, Te Raumati - Maamaa, Epoxies, Kariki, Pahi and Te wera - Te waipiro ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-01D-13-C2-R0 electronic components. ATS-01D-13-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-01D-13-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-01D-13-C2-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-01D-13-C2-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
HEATSINK 50X50X15MM XCUT T766
Toa :
pushPIN™
Wāhanga wahi :
Active
Momo :
Top Mount
Paetene :
Assorted (BGA, LGA, CPU, ASIC...)
Tikanga whakapiri :
Push Pin
Hanga :
Square, Fins
Te roanga :
1.969" (50.00mm)
Whanui :
1.969" (50.00mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.590" (15.00mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
13.70°C/W @ 100 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Blue Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x152.4mm
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511-12U
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm
-
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