A15427-005 Utu (USD) [173187Stock Ngahau]
- 1 pcs$0.21357
- 10 pcs$0.20408
- 25 pcs$0.19395
- 50 pcs$0.18881
- 100 pcs$0.18624
- 250 pcs$0.17347
- 500 pcs$0.16326
- 1,000 pcs$0.14796
- 5,000 pcs$0.14285
- Te waahanga waahanga:
- A15427-005
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 19.05MMX12.7MM AMBER.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: DC Fans, Te wera - Hoko te werawera, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Utu - Taonga, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Raumati - Pads, Rau, Te wera - Te waipiro and Ahua AC ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials A15427-005 electronic components. A15427-005 can be shipped within 24 hours after order. If you have any demands for A15427-005, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A15427-005 Nga Hua Hua
Te waahanga waahanga :
A15427-005
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 19.05MMX12.7MM AMBER
Toa :
Tgard™ K52
Wāhanga wahi :
Active
Whakamahi :
TO-220
Momo :
Insulator Pad, Sheet
Hanga :
Rectangular
Rarangi :
19.05mm x 12.70mm
Paruparu :
0.0030" (0.076mm)
Ahumahi :
Polyimide, Ceramic Filled
Whakapiri :
-
Te tuuri, kawe :
-
Tae :
Amber
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
-
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
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THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
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