HS13 Utu (USD) [1194Stock Ngahau]
- 1 pcs$37.68945
- 10 pcs$35.33450
- 25 pcs$32.97862
- 50 pcs$31.80091
- 100 pcs$30.62306
- Te waahanga waahanga:
- HS13
- Kaihanga:
- Apex Microtechnology
- Whakaahuatanga Taipitopito:
- HEATSINK TO3. Relay Sockets & Hardware DIN Mount Heat Sink 0.8 C/W
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te wera - Hoko te werawera, Whanau - Taonga - Raea Fan, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Ahua AC, Te wera - Te waipiro, Utu - Taonga, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu and Te Raumati - Thermoelectric, Peltier Assemblies ...
- Whakapai Tinana:
- We specialize in Apex Microtechnology HS13 electronic components. HS13 can be shipped within 24 hours after order. If you have any demands for HS13, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
HS13 Nga Hua Hua
Te waahanga waahanga :
HS13
Kaihanga :
Apex Microtechnology
Whakaahuatanga :
HEATSINK TO3
Toa :
Apex Precision Power®
Wāhanga wahi :
Active
Momo :
Board Level, Extrusion
Paetene :
TO-3
Tikanga whakapiri :
Bolt On
Hanga :
Rectangular, Fins
Te roanga :
5.421" (139.70mm)
Whanui :
4.812" (122.22mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
1.310" (33.27mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
0.40°C/W @ 800 LFM
Te Maawerawera Rererangi @ Tinana :
1.48°C/W
Ahumahi :
Aluminum
He Oti Taonga :
Black Anodized
Kia Korero Ma Te Korero
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512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
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