ATS-H1-30-C2-R0 Utu (USD) [5596Stock Ngahau]
- 1 pcs$6.90577
- 10 pcs$6.52280
- 25 pcs$6.13895
- 50 pcs$5.75528
- 100 pcs$5.37156
- 250 pcs$4.98788
- 500 pcs$4.89195
- Te waahanga waahanga:
- ATS-H1-30-C2-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- HEATSINK 70X70X25MM XCUT T766.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Ahua AC, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Raumati - Pads, Rau, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, DC Fans, Whanau - Taonga - Raea Fan and Te wera - Hoko te werawera ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-H1-30-C2-R0 electronic components. ATS-H1-30-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-H1-30-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-H1-30-C2-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-H1-30-C2-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
HEATSINK 70X70X25MM XCUT T766
Toa :
pushPIN™
Wāhanga wahi :
Active
Momo :
Top Mount
Paetene :
Assorted (BGA, LGA, CPU, ASIC...)
Tikanga whakapiri :
Push Pin
Hanga :
Square, Fins
Te roanga :
2.756" (70.00mm)
Whanui :
2.756" (70.00mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.984" (25.00mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
5.31°C/W @ 100 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Blue Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
Nga Wahanga Panu
- AQP-HS-40A
- ATS-61450W-C1-R0
- 2-1542006-5
- 6-1542005-1
- DA-T263-101E
- DV-T263-101E
- 832202B00000
- 822802B00000
- 412320B02500
- APR40-40-12CB/A01
- MHST10040
- MHSL05025
- 7-438-X44-BA
- HP3-TO3-CB
- 2-1963562-7
- 1963054-1
- 2-1963561-4
- 2-1963561-3
- 1-1963561-3
- 2-1963563-3
- 1-1963558-4
- 1-1963555-7
- 1-1963559-2
- 1-1963556-4
- 2-1963552-7
- 1-1963554-2
- 2-1963557-3
- 1-1963556-3
- 2-1963553-5
- 2-1963552-3
- 1-1963551-3
- 1-1963552-3
- 39880100100
- 7156BA
- APR38-38-12CB/T
- LBE66B1CB
- 1542295-2
- OMNI-UNI-34-25
- 6400BG
- 4-1542012-5