Laird Technologies EMI - 67SLG050060050PI00

KEY Part #: K7358942

67SLG050060050PI00 Utu (USD) [423786Stock Ngahau]

  • 1 pcs$0.08728
  • 850 pcs$0.07864
  • 1,700 pcs$0.07036
  • 2,550 pcs$0.06415
  • 5,950 pcs$0.06001
  • 21,250 pcs$0.05588
  • 42,500 pcs$0.05298

Te waahanga waahanga:
67SLG050060050PI00
Kaihanga:
Laird Technologies EMI
Whakaahuatanga Taipitopito:
METAL FILM OVER FOAM CONTACTS.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: RF Mana Whakauru RF, RFID, RF Urunga, Aroturuki ICs, RF Antennas, Attenuators, Kaihoko RF, RF Tukuna Tere, RF Demodulators and Kit Rau Aromātai me te Whakawhanake, Poari ...
Whakapai Tinana:
We specialize in Laird Technologies EMI 67SLG050060050PI00 electronic components. 67SLG050060050PI00 can be shipped within 24 hours after order. If you have any demands for 67SLG050060050PI00, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

67SLG050060050PI00 Nga Hua Hua

Te waahanga waahanga : 67SLG050060050PI00
Kaihanga : Laird Technologies EMI
Whakaahuatanga : METAL FILM OVER FOAM CONTACTS
Toa : SMD Grounding Metallized
Wāhanga wahi : Active
Momo : Film Over Foam
Hanga : Rectangle
Whanui : 0.197" (5.00mm)
Te roanga : 0.197" (5.00mm)
Te teitei : 0.236" (6.00mm)
Ahumahi : Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Paramuata : -
Paramu - Ngaa : -
Tikanga whakapiri : Solder
Taumaha Mahi : -40°C ~ 70°C