Xilinx Inc. - XCKU3P-1FFVB676I

KEY Part #: K1074224

[68Stock Ngahau]

Te waahanga waahanga:: XCKU3P-1FFVB676I

Kaihanga:: Xilinx Inc.

Whakaahuatanga Taipitopito:: XCKU3P-1FFVB676I.

Ko te wa kaiarahi paerewa a te kaihanga:: I roto i te taonga

Te whare noho:: Kotahi Tau

Chip Mai:: Hong Kong

RoHS:

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Ngā Kāwai Whānau:: KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Logic - Nga Koki me nga Kaituri, Whakawhiwhinga Raraunga - ADCs / DACs - Takenga Mo, Whakauruhia - FPGA (Kaha Hoahoa Ka taea te Maama), Karaka / Taima - Tapahi Raina, Taki - FIFOs Memory, PMIC - Kaiwhakahaere Tohutoro - Raina + Whakawhiti, PMIC - Atekiwa Peere and Atanga - Tauira - ICs me te Tohu ...

Whakapai Tinana:: We specialize in Xilinx Inc. XCKU3P-1FFVB676I electronic components. XCKU3P-1FFVB676I can be shipped within 24 hours after order. If you have any demands for XCKU3P-1FFVB676I, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

GB-T-27922

ISO-9001-2015

ISO-13485

ISO-14001

ISO-28000-2007

ISO-45001-2018

XCKU3P-1FFVB676I Nga Hua Hua

Te waahanga waahanga : XCKU3P-1FFVB676I

Kaihanga : Xilinx Inc.

Whakaahuatanga : XCKU3P-1FFVB676I

Toa : Kintex® UltraScale+™

Wāhanga wahi : Active

Tuhinga o mua : 20340

Te maha o nga waahanga arorau / pūtau : 355950

Tapeke RAM Tapeke : 31641600

Tau o ahau / O : 280

Tuhinga o mua : -

Tauira - Whakaputanga : 0.825V ~ 0.876V

Momo Momo : Surface Mount

Taumaha Mahi : -40°C ~ 100°C (TJ)

Paepae / Take : 676-BBGA, FCBGA

Paetukutuku Pūrere Kaiwhakarato : 676-FCBGA (27x27)

Nga Pūrongo Hou

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Xilinx Virtex® UltraScale™ FPGA VCU110 Development Kit

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Xilinx Zynq UltraScale RFSoC ZCU1275 Characterization Kit

Xilinx Virtex®-7 FPGA VC709 Connectivity Kit

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Xilinx Virtex®-7 FPGA VC7222 Characterization Kit

Xilinx UltraScale™ FPGA KCU1250 Characterization Kit

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Nga Wahanga Panu

English Maori