Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) - B39242B4347P810

KEY Part #: K7049177

B39242B4347P810 Utu (USD) [112563Stock Ngahau]

  • 1 pcs$0.32859

Te waahanga waahanga:
B39242B4347P810
Kaihanga:
Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Whakaahuatanga Taipitopito:
CSSP3 CU AE. Signal Conditioning CSSP3 Cu AE AEC-Q200
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Papa Maama me te papa pereti, Poroakau Ferrite me te Chip, Rauemi EMI / RFI (LC, RC Networks), Nga taputapu, Te Whakanuitanga Ma Te Kai-whakahaere, He whiriwhiringa, Tutei Kaetapeke noa and Tātari DSL ...
Whakapai Tinana:
We specialize in Qualcomm (RF360 - A Qualcomm & TDK Joint Venture) B39242B4347P810 electronic components. B39242B4347P810 can be shipped within 24 hours after order. If you have any demands for B39242B4347P810, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

B39242B4347P810 Nga Hua Hua

Te waahanga waahanga : B39242B4347P810
Kaihanga : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Whakaahuatanga : CSSP3 CU AE
Toa : B4347
Wāhanga wahi : Active
Te Maha - Te Pokapu : 2.442GHz
Pūhikoi : 83.5MHz
Te Whakauru Whiriwhiria : 1.8dB
Whakatauranga : AEC-Q200
Nga tono : Bluetooth, WLAN
Momo Momo : Surface Mount
Paepae / Take : 5-SMD, No Lead
Te teitei (Max) : 0.018" (0.45mm)
Rahi / Rahi : 0.055" L x 0.043" W (1.40mm x 1.10mm)

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