Panasonic Electronic Components - EYG-S0811ZLWG

KEY Part #: K6153147

EYG-S0811ZLWG Utu (USD) [6370Stock Ngahau]

  • 1 pcs$6.46948
  • 10 pcs$6.11031
  • 25 pcs$5.75113
  • 50 pcs$5.39161
  • 100 pcs$5.03218
  • 250 pcs$4.67272
  • 500 pcs$4.58287

Te waahanga waahanga:
EYG-S0811ZLWG
Kaihanga:
Panasonic Electronic Components
Whakaahuatanga Taipitopito:
THERM PAD 108MMX78MM GRAY. Thermal Interface Products Soft PGS - IGBT Mod Mitsubishi Elec.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Raumati - Pads, Rau, Utu - Taonga, Te wera - Te waipiro, Ahua AC, Whanau - Taonga - Raea Fan, Te Raumati - Thermoelectric, Peltier Assemblies and Te Werawera - Thermoelectric, Peltier Modules ...
Whakapai Tinana:
We specialize in Panasonic Electronic Components EYG-S0811ZLWG electronic components. EYG-S0811ZLWG can be shipped within 24 hours after order. If you have any demands for EYG-S0811ZLWG, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

EYG-S0811ZLWG Nga Hua Hua

Te waahanga waahanga : EYG-S0811ZLWG
Kaihanga : Panasonic Electronic Components
Whakaahuatanga : THERM PAD 108MMX78MM GRAY
Toa : Soft-PGS
Wāhanga wahi : Active
Whakamahi : IGBT - Heat Transfer Low Thermal Resistance
Momo : Graphite-Pad, Sheet
Hanga : Rectangular
Rarangi : 108.00mm x 78.00mm
Paruparu : 0.0079" (0.200mm)
Ahumahi : Graphite
Whakapiri : -
Te tuuri, kawe : -
Tae : Gray
Whanatau Whakahohaetanga : -
Te Whanonga Haumaru : 20 W/m-K

Kia Korero Ma Te Korero
  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-220-N

    Wakefield-Vette

    THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole

  • CD-02-05-C-22

    Wakefield-Vette

    THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole