ATS-P2-27-C2-R0 Utu (USD) [7959Stock Ngahau]
- 1 pcs$4.85651
- 10 pcs$4.58548
- 25 pcs$4.31569
- 50 pcs$4.04607
- 100 pcs$3.77627
- 250 pcs$3.50656
- 500 pcs$3.43912
- 1,000 pcs$3.37169
- Te waahanga waahanga:
- ATS-P2-27-C2-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- HEATSINK 70X70X12.7MM XCUT T766.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Meaa, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Thermoelectric, Peltier Modules, Utu - Taonga, Te Raumati - Thermoelectric, Peltier Assemblies and Ahua AC ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-P2-27-C2-R0 electronic components. ATS-P2-27-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-P2-27-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-P2-27-C2-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-P2-27-C2-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
HEATSINK 70X70X12.7MM XCUT T766
Toa :
pushPIN™
Wāhanga wahi :
Active
Momo :
Top Mount
Paetene :
Assorted (BGA, LGA, CPU, ASIC...)
Tikanga whakapiri :
Push Pin
Hanga :
Square, Fins
Te roanga :
2.756" (70.00mm)
Whanui :
2.756" (70.00mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.500" (12.70mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
12.24°C/W @ 100 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Blue Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
-
-
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