Amphenol ICC (FCI) - DILB18P-223TLF

KEY Part #: K3363434

DILB18P-223TLF Utu (USD) [283397Stock Ngahau]

  • 1 pcs$0.13051
  • 15,600 pcs$0.04565

Te waahanga waahanga:
DILB18P-223TLF
Kaihanga:
Amphenol ICC (FCI)
Whakaahuatanga Taipitopito:
CONN IC DIP SOCKET 18POS TINLEAD. IC & Component Sockets SOCKETS DIP
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Kaitono Taimana - Nga Tapuwae me nga Taapiri Taima, He Kaihono Tuku Hoahono - Nga Hoapapa, Papaahi - Hononga Ipurangi Wire, D-Sub, Kaihono-D Whakawhitihia - Taputapu - Jacksc, Nga Pouaka mo nga IC, Nga Kaituri - Nga Whakahau, Te Hononga Rectangular - Arrays, Momo Tono, Mezzan, Hononga-D and Mutunga - Hononga Ipurangi waea ...
Whakapai Tinana:
We specialize in Amphenol ICC (FCI) DILB18P-223TLF electronic components. DILB18P-223TLF can be shipped within 24 hours after order. If you have any demands for DILB18P-223TLF, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DILB18P-223TLF Nga Hua Hua

Te waahanga waahanga : DILB18P-223TLF
Kaihanga : Amphenol ICC (FCI)
Whakaahuatanga : CONN IC DIP SOCKET 18POS TINLEAD
Toa : DILB
Wāhanga wahi : Active
Momo : DIP, 0.3" (7.62mm) Row Spacing
Te maha o nga tuunga me nga titi ranei (Kere) : 18 (2 x 9)
Piita - Kaore : 0.100" (2.54mm)
Whakawhitiwhiti ki te Oti : Tin-Lead
Whakapā atu ki Oti Whakamutu : 100.0µin (2.54µm)
Material Whakapā - Kaitohu : Copper Alloy
Momo Momo : Through Hole
Nga Huihuinga : Open Frame
Whakamutu : Solder
Piita - Post : 0.100" (2.54mm)
Whakawhitihia te Whakaputa - Post : Tin-Lead
Whakapā atu ki Oti Whakamutu : 100.0µin (2.54µm)
Material Whakapā - Puku : Copper Alloy
Whare Papainga : Polyamide (PA), Nylon
Taumaha Mahi : -55°C ~ 125°C