Te waahanga waahanga :
0C97054017
Kaihanga :
Laird Technologies EMI
Whakaahuatanga :
RFI EMI GROUNDING MATERIAL 25FT
Te roanga :
16.000" (406.40mm)
Te teitei :
0.110" (2.79mm)
Ahumahi :
Beryllium Copper
Paramu - Ngaa :
299.21µin (7.60µm)
Tikanga whakapiri :
Adhesive