ATS-59000-C1-R0 Utu (USD) [3254Stock Ngahau]
- 1 pcs$11.91608
- 10 pcs$11.21557
- 25 pcs$10.51450
- 50 pcs$9.81353
- 100 pcs$9.46300
- 250 pcs$8.93728
- 500 pcs$8.76205
- Te waahanga waahanga:
- ATS-59000-C1-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- HEAT SINK 21MM X 45MM X 9MM. Heat Sinks maxiGRIP Heatsink Assembly, Black-Anodized, T766, 21mm Comp, 21x45x9mm
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Ahua AC, Te wera - Te waipiro, Whanau - Taonga - Raea Fan, Te Werawera - Meaa, Te Raumati - Pads, Rau, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, DC Fans and Te Raumati - Maamaa, Epoxies, Kariki, Pahi ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-59000-C1-R0 electronic components. ATS-59000-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-59000-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-59000-C1-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-59000-C1-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
HEAT SINK 21MM X 45MM X 9MM
Toa :
maxiGRIP
Wāhanga wahi :
Active
Momo :
Top Mount
Paetene :
Flip Chip Processors
Tikanga whakapiri :
Clip
Hanga :
Rectangular, Angled Fins
Te roanga :
0.827" (21.00mm)
Whanui :
1.772" (45.00mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.354" (9.00mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
6.10°C/W @ 200 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Black Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
-
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