ATS-FPX035035035-90-C2-R0 Utu (USD) [17914Stock Ngahau]
- 1 pcs$2.16384
- 10 pcs$2.10787
- 25 pcs$2.05102
- 50 pcs$1.93714
- 100 pcs$1.82318
- 250 pcs$1.70921
- 500 pcs$1.65224
- 1,000 pcs$1.48132
- Te waahanga waahanga:
- ATS-FPX035035035-90-C2-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- HEATSINK 35X35X35MM R-TAB FP.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te wera - Hoko te werawera, DC Fans, Te Werawera - Meaa, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te wera - Te waipiro, Te Raumati - Pads, Rau, Ahua AC and Utu - Taonga ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-FPX035035035-90-C2-R0 electronic components. ATS-FPX035035035-90-C2-R0 can be shipped within 24 hours after order. If you have any demands for ATS-FPX035035035-90-C2-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-FPX035035035-90-C2-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-FPX035035035-90-C2-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
HEATSINK 35X35X35MM R-TAB FP
Toa :
pushPIN™
Wāhanga wahi :
Active
Momo :
Top Mount
Paetene :
Assorted (BGA, LGA, CPU, ASIC...)
Tikanga whakapiri :
Push Pin
Hanga :
Square, Fins
Te roanga :
1.378" (35.00mm)
Whanui :
1.378" (35.00mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
1.378" (35.00mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
6.36°C/W @ 100 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Blue Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
512-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
-
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