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  1. Whare
  2. Nga Hua
  3. DRAM
  4. DDR3
  5. K4B4G1646D-BCH9

Samsung Semiconductor - K4B4G1646D-BCH9

KEY Part #: K7359687

[15623Stock Ngahau]

    Te waahanga waahanga:
    K4B4G1646D-BCH9
    Kaihanga:
    Samsung Semiconductor
    Whakaahuatanga Taipitopito:
    4 Gb 256M x 16 1333 Mbps 1.5 V 0 ~ 85 °C 96FBGA Mass Production.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: LPDDR3, MODULE, LPDDR5, DDR4, SLC Nand, LPDDR4X, GDDR6 and LPDDR4 ...
    Whakapai Tinana:
    We specialize in Samsung Semiconductor K4B4G1646D-BCH9 electronic components. K4B4G1646D-BCH9 can be shipped within 24 hours after order. If you have any demands for K4B4G1646D-BCH9, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4B4G1646D-BCH9 Nga Hua Hua

    Te waahanga waahanga : K4B4G1646D-BCH9
    Kaihanga : Samsung Semiconductor
    Whakaahuatanga : 4 Gb 256M x 16 1333 Mbps 1.5 V 0 ~ 85 °C 96FBGA Mass Production
    Toa : DDR3
    kiato : 4 Gb
    Org. : 256M x 16
    tere : 1333 Mbps
    ngaohiko : 1.5 V
    Temp. : 0 ~ 85 °C
    mōkī : 96FBGA
    Tūnga hua : Mass Production

    Nga Pūrongo Hou

    SSDs, DRAM and gaming: Unlocking a new level of performance
    Automotive Driven by Small Packages Under the Hood
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    Samsung Now Mass Producing Industry’s First, 20-Nanometer 6Gb LPDDR3 Mobile DRAM
    5G and Memory - from Connected Thinking to Connected Living
    How Will 5G Impact on Memory?
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Unlocking the Power of Cloud Computing
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    Samsung Enhances Functional Safety to its Automotive Semiconductors with ISO 26262 Certification
    The future of NAND technology
    Bringing Artificial Intelligence to Devices Everywhere
    Kia Korero Ma Te Korero
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      DDR4 UDIMM 8 GB 1R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    • M378A1K43BB2-CRC

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      DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    • K3UH5H50AM-AGCL

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      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.

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      32 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.

    • K3UH5H50AM-JGCL

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    • K3UH6H60BM-AGCL

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    Nga Wahanga Panu