3M - 228-1290-00-0602J

KEY Part #: K3348878

228-1290-00-0602J Utu (USD) [4383Stock Ngahau]

  • 1 pcs$9.40962
  • 10 pcs$8.49553
  • 25 pcs$7.74222
  • 50 pcs$7.25833
  • 100 pcs$7.01638
  • 250 pcs$6.62927
  • 500 pcs$6.43572

Te waahanga waahanga:
228-1290-00-0602J
Kaihanga:
3M
Whakaahuatanga Taipitopito:
CONN IC DIP SOCKET ZIF 28POS GLD. IC & Component Sockets 0.070" DIP SOCKET 28 Contact Qty.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: He Kaihono Tuku Hoahono - Nga Panui, Nga Poraka Poto - Nga Taonga - nga Raima Taimana, Nga Raumahi Whakawhitinga Huringa, Tūhono Mahara - Pouaka Whakaaturanga Inihi, He Kaihono Momo Waaho Hononga - Housings, Nga Poraka Pahi - Nga upoko, Paramu me nga Pou, Nga Poraka Puka - Whakauru and Te Papaa - Barrel, Kaitono Taea ...
Whakapai Tinana:
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GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

228-1290-00-0602J Nga Hua Hua

Te waahanga waahanga : 228-1290-00-0602J
Kaihanga : 3M
Whakaahuatanga : CONN IC DIP SOCKET ZIF 28POS GLD
Toa : Textool™
Wāhanga wahi : Active
Momo : DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Te maha o nga tuunga me nga titi ranei (Kere) : 28 (2 x 14)
Piita - Kaore : 0.070" (1.78mm)
Whakawhitiwhiti ki te Oti : Gold
Whakapā atu ki Oti Whakamutu : 30.0µin (0.76µm)
Material Whakapā - Kaitohu : Beryllium Copper
Momo Momo : Connector
Nga Huihuinga : Closed Frame
Whakamutu : Press-Fit
Piita - Post : 0.100" (2.54mm)
Whakawhitihia te Whakaputa - Post : Gold
Whakapā atu ki Oti Whakamutu : 30.0µin (0.76µm)
Material Whakapā - Puku : Beryllium Copper
Whare Papainga : Polysulfone (PSU), Glass Filled
Taumaha Mahi : -55°C ~ 125°C

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