Omron Electronics Inc-EMC Div - XR2A-1801-N

KEY Part #: K3361094

XR2A-1801-N Utu (USD) [38171Stock Ngahau]

  • 1 pcs$1.02435
  • 26 pcs$0.90262

Te waahanga waahanga:
XR2A-1801-N
Kaihanga:
Omron Electronics Inc-EMC Div
Whakaahuatanga Taipitopito:
CONN IC DIP SOCKET 18POS GOLD. IC & Component Sockets Socket DIP Term 18P 7.62mm .75AuPlate
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: He Kaihono Tuku Hoahono - Nga Hoapapa, Tūhono Taimana - Whakapono, Tūhono Mahara - Papa PC - Kaupapa, Hononga Piri Momo Waaho - Hoapapa, Kaihono Tono - Taputapu, Nga Raumahi Whakawhitinga Huringa, FFC, FPC (Flat Flexible) Tūhono - Housings and USB, DVI, HDMI Hono - Nga Taonga ...
Whakapai Tinana:
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GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

XR2A-1801-N Nga Hua Hua

Te waahanga waahanga : XR2A-1801-N
Kaihanga : Omron Electronics Inc-EMC Div
Whakaahuatanga : CONN IC DIP SOCKET 18POS GOLD
Toa : XR2
Wāhanga wahi : Active
Momo : DIP, 0.3" (7.62mm) Row Spacing
Te maha o nga tuunga me nga titi ranei (Kere) : 18 (2 x 9)
Piita - Kaore : 0.100" (2.54mm)
Whakawhitiwhiti ki te Oti : Gold
Whakapā atu ki Oti Whakamutu : 30.0µin (0.76µm)
Material Whakapā - Kaitohu : Beryllium Copper
Momo Momo : Through Hole
Nga Huihuinga : Open Frame
Whakamutu : Solder
Piita - Post : 0.100" (2.54mm)
Whakawhitihia te Whakaputa - Post : Gold
Whakapā atu ki Oti Whakamutu : 30.0µin (0.76µm)
Material Whakapā - Puku : Beryllium Copper
Whare Papainga : Polybutylene Terephthalate (PBT), Glass Filled
Taumaha Mahi : -55°C ~ 125°C