CTS Thermal Management Products - BDN09-3CB

KEY Part #: K6265475

BDN09-3CB Utu (USD) [48708Stock Ngahau]

  • 1 pcs$0.71077
  • 10 pcs$0.67523
  • 25 pcs$0.65742
  • 50 pcs$0.63969
  • 100 pcs$0.60415
  • 250 pcs$0.56862
  • 500 pcs$0.53308
  • 1,000 pcs$0.49754
  • 5,000 pcs$0.47977

Te waahanga waahanga:
BDN09-3CB
Kaihanga:
CTS Thermal Management Products
Whakaahuatanga Taipitopito:
HEATSINK CPU .91 SQ.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Whanau - Taonga - Raea Fan, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te wera - Hoko te werawera, Te Werawera - Meaa, Te Werawera - Thermoelectric, Peltier Modules and Te Raumati - Pads, Rau ...
Whakapai Tinana:
We specialize in CTS Thermal Management Products BDN09-3CB electronic components. BDN09-3CB can be shipped within 24 hours after order. If you have any demands for BDN09-3CB, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN09-3CB Nga Hua Hua

Te waahanga waahanga : BDN09-3CB
Kaihanga : CTS Thermal Management Products
Whakaahuatanga : HEATSINK CPU .91 SQ
Toa : BDN
Wāhanga wahi : Active
Momo : Top Mount
Paetene : Assorted (BGA, LGA, CPU, ASIC...)
Tikanga whakapiri : Thermal Tape, Adhesive (Not Included)
Hanga : Square, Pin Fins
Te roanga : 0.910" (23.11mm)
Whanui : 0.910" (23.11mm)
Raimana : -
Te Runga Matua (Te Runga o te Fin) : 0.355" (9.02mm)
Te Whakamutunga Kaha @ Whakarewa : -
Te Ururua Raumati @ Whakahaerehia Ma Te Hau : 9.60°C/W @ 400 LFM
Te Maawerawera Rererangi @ Tinana : 26.90°C/W
Ahumahi : Aluminum
He Oti Taonga : Black Anodized

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