Te waahanga waahanga :
67SLG040035030PI00
Kaihanga :
Laird Technologies EMI
Whakaahuatanga :
METAL FILM OVER FOAM CONTACTS
Toa :
SMD Grounding Metallized
Te roanga :
0.118" (3.00mm)
Te teitei :
0.138" (3.50mm)
Ahumahi :
Polyurethane Foam, Tin-Copper Polyester (SN/CU)
Tikanga whakapiri :
Solder
Taumaha Mahi :
-40°C ~ 70°C