B-375-120-62G Utu (USD) [17897Stock Ngahau]
- 1 pcs$2.47616
- 5,000 pcs$2.46384
- Te waahanga waahanga:
- B-375-120-62G
- Whakaahuatanga Taipitopito:
- HEAT SINK.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Raumati - Thermoelectric, Peltier Assemblies, Te Werawera - Meaa, Te wera - Te waipiro, DC Fans, Ahua AC, Whanau - Taonga - Raea Fan and Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu ...
- Whakapai Tinana:
- We specialize in Aavid, Thermal Division of Boyd Corporation B-375-120-62G electronic components. B-375-120-62G can be shipped within 24 hours after order. If you have any demands for B-375-120-62G, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
B-375-120-62G Nga Hua Hua
Te waahanga waahanga :
B-375-120-62G
Kaihanga :
Aavid, Thermal Division of Boyd Corporation
Whakaahuatanga :
HEAT SINK
Toa :
*
Wāhanga wahi :
Active
Momo :
-
Paetene :
-
Tikanga whakapiri :
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Hanga :
-
Te roanga :
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Whanui :
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Raimana :
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Te Runga Matua (Te Runga o te Fin) :
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Te Whakamutunga Kaha @ Whakarewa :
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Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
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Te Maawerawera Rererangi @ Tinana :
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Ahumahi :
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He Oti Taonga :
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Kia Korero Ma Te Korero
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511-3M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 132.33x76.2mm
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1-1542002-1
TE Connectivity AMP Connectors
HEAT SINK BGA 37.5MM 2FIN RADIAL. Heat Sinks 2 Fin Radial 37.5 x 37.5
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C264-085-3VE
Ohmite
HEATSINK AND CLIPS FOR 3 TO-264. Heat Sinks HEATSINK FOR TO-264 3 CLIPS, NO FINISH
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TXP1808B
CTS Thermal Management Products
THERMAL LINK PRESS ON BLACK TO-1. Heat Sinks THERMAL LINK PRESS ON BLK
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TXBE032031B
CTS Thermal Management Products
HEATSINK PRESS ON BLACK TO-5. Heat Sinks TO-5 Solder Glue Adhesive mt.
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