V2003X Utu (USD) [207824Stock Ngahau]
- 1 pcs$0.17797
- 10 pcs$0.16967
- 25 pcs$0.16121
- 50 pcs$0.15701
- 100 pcs$0.15492
- 250 pcs$0.14431
- 500 pcs$0.13581
- 1,000 pcs$0.12308
- 5,000 pcs$0.11884
- Te waahanga waahanga:
- V2003X
- Kaihanga:
- Assmann WSW Components
- Whakaahuatanga Taipitopito:
- HEAT SINK BLK ANOD ALUM TO-220.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te wera - Hoko te werawera, Te Raumati - Thermoelectric, Peltier Assemblies, Whanau - Taonga - Raea Fan, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te wera - Te waipiro, DC Fans, Te Raumati - Maamaa, Epoxies, Kariki, Pahi and Te Werawera - Thermoelectric, Peltier Modules ...
- Whakapai Tinana:
- We specialize in Assmann WSW Components V2003X electronic components. V2003X can be shipped within 24 hours after order. If you have any demands for V2003X, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
V2003X Nga Hua Hua
Te waahanga waahanga :
V2003X
Kaihanga :
Assmann WSW Components
Whakaahuatanga :
HEAT SINK BLK ANOD ALUM TO-220
Toa :
-
Wāhanga wahi :
Active
Momo :
Board Level
Paetene :
TO-220
Tikanga whakapiri :
Bolt On
Hanga :
Rectangular, Fins
Te roanga :
0.748" (19.00mm)
Whanui :
0.866" (22.00mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.748" (19.00mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
-
Te Maawerawera Rererangi @ Tinana :
22.00°C/W
Ahumahi :
Aluminum
He Oti Taonga :
Black Anodized
Kia Korero Ma Te Korero
-
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
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510-6M
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
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HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
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122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
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