ATS-61330D-C1-R0 Utu (USD) [7277Stock Ngahau]
- 1 pcs$5.06805
- 10 pcs$4.82831
- 25 pcs$4.52669
- 50 pcs$4.37589
- 100 pcs$4.01372
- 250 pcs$3.77229
- 500 pcs$3.69684
- 1,000 pcs$3.68175
- Te waahanga waahanga:
- ATS-61330D-C1-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- MAXIGRIP FANSINK 33X33X9.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 32.25x32.25x9.5mm, 32.25mm dia.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Thermoelectric, Peltier Assemblies, Te Werawera - Thermoelectric, Peltier Modules, Te Raumati - Pads, Rau, Te Werawera - Meaa, Te wera - Hoko te werawera, Te wera - Te waipiro, DC Fans and Whanau - Taonga - Raea Fan ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-61330D-C1-R0 electronic components. ATS-61330D-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-61330D-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-61330D-C1-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-61330D-C1-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
MAXIGRIP FANSINK 33X33X9.5MM
Toa :
fanSINK, maxiGRIP
Wāhanga wahi :
Active
Momo :
Top Mount
Paetene :
BGA
Tikanga whakapiri :
Clip, Thermal Material
Hanga :
Square, Pin Fins
Te roanga :
1.299" (32.99mm)
Whanui :
1.299" (32.99mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.374" (9.50mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
2.70°C/W @ 200 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Black Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
511-3U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm
-
510-6M
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm
-
396-2AB
Wakefield-Vette
HEATSINK 5.5X5X1.38 POWER/IGBT. Heat Sinks Performance, Low Profile Heatsink for Power Modules & IGBTs, 139.7x35.1x127mm, 6 Mounting Holes
-
122259
Wakefield-Vette
HEATSINK 16639 PROFILE 12. Heat Sinks 16639 Extrusion Profile Cut to 12 Inches, 12x7.9x1.31 Inch, High Aspect Ratio
-
-
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