Amphenol ICC (FCI) - SIP1X08-001BLF

KEY Part #: K3351445

[11896Stock Ngahau]


    Te waahanga waahanga:
    SIP1X08-001BLF
    Kaihanga:
    Amphenol ICC (FCI)
    Whakaahuatanga Taipitopito:
    CONN SOCKET SIP 8POS GOLD.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Nga Poraka Poto - Waea ki te Poari, Nga Poraka Puka - Te Tohatoha o te Mana, Hononga Utu (RF) - Hoapapa, He Kaihono Tuku Hoahono - Nga Panui, FFC, FPC (Flat Flexible) Tūhono - Housings, Tūhono Taimana - Taputapu, Mutunga - Tūhono Rectangular and Te Hononga Rectangular - Arrays, Momo Tono, Mezzan ...
    Whakapai Tinana:
    We specialize in Amphenol ICC (FCI) SIP1X08-001BLF electronic components. SIP1X08-001BLF can be shipped within 24 hours after order. If you have any demands for SIP1X08-001BLF, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    SIP1X08-001BLF Nga Hua Hua

    Te waahanga waahanga : SIP1X08-001BLF
    Kaihanga : Amphenol ICC (FCI)
    Whakaahuatanga : CONN SOCKET SIP 8POS GOLD
    Toa : SIP1x
    Wāhanga wahi : Obsolete
    Momo : SIP
    Te maha o nga tuunga me nga titi ranei (Kere) : 8 (1 x 8)
    Piita - Kaore : 0.100" (2.54mm)
    Whakawhitiwhiti ki te Oti : Gold
    Whakapā atu ki Oti Whakamutu : 30.0µin (0.76µm)
    Material Whakapā - Kaitohu : Beryllium Copper
    Momo Momo : Through Hole
    Nga Huihuinga : Closed Frame
    Whakamutu : Solder
    Piita - Post : 0.100" (2.54mm)
    Whakawhitihia te Whakaputa - Post : Tin
    Whakapā atu ki Oti Whakamutu : 200.0µin (5.08µm)
    Material Whakapā - Puku : Brass
    Whare Papainga : Polyphenylene Sulfide (PPS), Glass Filled
    Taumaha Mahi : -

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