CTS Thermal Management Products - BDN09-3CB/A01

KEY Part #: K6235937

BDN09-3CB/A01 Utu (USD) [35025Stock Ngahau]

  • 1 pcs$0.98254
  • 10 pcs$0.95745
  • 25 pcs$0.93169
  • 50 pcs$0.87993
  • 100 pcs$0.82817
  • 250 pcs$0.77641
  • 500 pcs$0.75053
  • 1,000 pcs$0.67289
  • 5,000 pcs$0.65995

Te waahanga waahanga:
BDN09-3CB/A01
Kaihanga:
CTS Thermal Management Products
Whakaahuatanga Taipitopito:
HEATSINK CPU W/ADHESIVE .91SQ.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Werawera - Thermoelectric, Peltier Modules, Te wera - Te waipiro, Te Raumati - Pads, Rau, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Whanau - Taonga - Raea Fan, DC Fans, Te Raumati - Thermoelectric, Peltier Assemblies and Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu ...
Whakapai Tinana:
We specialize in CTS Thermal Management Products BDN09-3CB/A01 electronic components. BDN09-3CB/A01 can be shipped within 24 hours after order. If you have any demands for BDN09-3CB/A01, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

BDN09-3CB/A01 Nga Hua Hua

Te waahanga waahanga : BDN09-3CB/A01
Kaihanga : CTS Thermal Management Products
Whakaahuatanga : HEATSINK CPU W/ADHESIVE .91SQ
Toa : BDN
Wāhanga wahi : Active
Momo : Top Mount
Paetene : Assorted (BGA, LGA, CPU, ASIC...)
Tikanga whakapiri : Thermal Tape, Adhesive (Included)
Hanga : Square, Pin Fins
Te roanga : 0.910" (23.11mm)
Whanui : 0.910" (23.11mm)
Raimana : -
Te Runga Matua (Te Runga o te Fin) : 0.355" (9.02mm)
Te Whakamutunga Kaha @ Whakarewa : -
Te Ururua Raumati @ Whakahaerehia Ma Te Hau : 9.60°C/W @ 400 LFM
Te Maawerawera Rererangi @ Tinana : 26.90°C/W
Ahumahi : Aluminum
He Oti Taonga : Black Anodized

Kia Korero Ma Te Korero
  • 510-3M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x76.2mm

  • 510-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks HEATSINK

  • 122255

    Wakefield-Vette

    HEATSINK 13694 PROFILE 12. Heat Sinks Extrusion Cut to Length, 12 Inch, High Aspect Ratio, Heatsink 13694, 12x6.9x2.8 Inch

  • 122254

    Wakefield-Vette

    HEATSINK 19671 PROFILE 12. Heat Sinks 19671 Extrusion Profile Cut to 12 Inches, 12x5.32x1.6 Inch, High Aspect Ratio

  • 26923

    Trenz Electronic GmbH

    HEATSINK FOR TE0715 SPRINGLOADED. Screwdrivers, Nut Drivers & Socket Drivers Sys 4 Hex 1/16 InterchangeableBlade

  • TG-CJ-LI-60-60-15-PF

    t-Global Technology

    HEATSINK CER 60X60X15MM W/TAPE.