A15896-06 Utu (USD) [741Stock Ngahau]
- 1 pcs$62.67561
- 3 pcs$59.69549
- Te waahanga waahanga:
- A15896-06
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 760 9x9" 5.0W/mK gap filler
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Whanau - Taonga - Raea Fan, Te wera - Hoko te werawera, Utu - Taonga, Ahua AC, Te Werawera - Thermoelectric, Peltier Modules, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, DC Fans and Te Raumati - Thermoelectric, Peltier Assemblies ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials A15896-06 electronic components. A15896-06 can be shipped within 24 hours after order. If you have any demands for A15896-06, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A15896-06 Nga Hua Hua
Te waahanga waahanga :
A15896-06
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 228.6MMX228.6MM GRAY
Toa :
Tflex™ 700
Wāhanga wahi :
Not For New Designs
Whakamahi :
-
Momo :
Gap Filler Pad, Sheet
Hanga :
Square
Rarangi :
228.60mm x 228.60mm
Paruparu :
0.0600" (1.524mm)
Ahumahi :
Silicone
Whakapiri :
Tacky - Both Sides
Te tuuri, kawe :
-
Tae :
Gray
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
5.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-220-N
Wakefield-Vette
THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
-
CD-02-05-C-22
Wakefield-Vette
THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
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