A14574-01 Utu (USD) [610Stock Ngahau]
- 1 pcs$76.39200
- 3 pcs$76.01194
- Te waahanga waahanga:
- A14574-01
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5200 9x9" 2.8W/mK gap filler
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te wera - Te waipiro, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te wera - Hoko te werawera, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Thermoelectric, Peltier Modules, DC Fans, Ahua AC and Te Raumati - Maamaa, Epoxies, Kariki, Pahi ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials A14574-01 electronic components. A14574-01 can be shipped within 24 hours after order. If you have any demands for A14574-01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A14574-01 Nga Hua Hua
Te waahanga waahanga :
A14574-01
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 228.6MMX228.6MM BLUE
Toa :
Tflex™ 500
Wāhanga wahi :
Not For New Designs
Whakamahi :
-
Momo :
Gap Filler Pad, Sheet
Hanga :
Square
Rarangi :
228.60mm x 228.60mm
Paruparu :
0.200" (5.08mm)
Ahumahi :
Silicone Elastomer
Whakapiri :
Tacky - Both Sides
Te tuuri, kawe :
-
Tae :
Blue
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
2.8 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-3-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-220
Wakefield-Vette
THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick
-
CD-02-05-220-N
Wakefield-Vette
THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
-
CD-02-05-C-34
Wakefield-Vette
THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole
-
CD-02-05-247-N
Wakefield-Vette
THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole
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