TE Connectivity AMP Connectors - 808-AG11D-LF

KEY Part #: K3362007

808-AG11D-LF Utu (USD) [60727Stock Ngahau]

  • 1 pcs$0.64387

Te waahanga waahanga:
808-AG11D-LF
Kaihanga:
TE Connectivity AMP Connectors
Whakaahuatanga Taipitopito:
CONN IC DIP SOCKET 8POS GOLD. IC & Component Sockets DIP .3CL 08P S/M OFRM AU/SN
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Tūhono Tauira - Paramu, D-Sub, Kaihono-D Whakawhitihia - Taputapu - Jacksc, FFC, FPC (Flat Flexible) Tūhono - Hoapā, Photovoltaic (Panui Panui) Hononga - Nga taonga, Pahi - Hononga Tireni, Tūhono Whakauru Mana - Puka, Paanga, Tauira, Nga Raumahi Whakawhitinga Huringa and Tūhono Mahara - Pouaka Whakaaturanga Inihi ...
Whakapai Tinana:
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GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

808-AG11D-LF Nga Hua Hua

Te waahanga waahanga : 808-AG11D-LF
Kaihanga : TE Connectivity AMP Connectors
Whakaahuatanga : CONN IC DIP SOCKET 8POS GOLD
Toa : 800
Wāhanga wahi : Active
Momo : DIP, 0.3" (7.62mm) Row Spacing
Te maha o nga tuunga me nga titi ranei (Kere) : 8 (2 x 4)
Piita - Kaore : 0.100" (2.54mm)
Whakawhitiwhiti ki te Oti : Gold
Whakapā atu ki Oti Whakamutu : 25.0µin (0.63µm)
Material Whakapā - Kaitohu : Beryllium Copper
Momo Momo : Through Hole
Nga Huihuinga : Open Frame
Whakamutu : Solder
Piita - Post : 0.100" (2.54mm)
Whakawhitihia te Whakaputa - Post : Gold
Whakapā atu ki Oti Whakamutu : 25.0µin (0.63µm)
Material Whakapā - Puku : Copper
Whare Papainga : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Taumaha Mahi : -55°C ~ 105°C