Samsung Semiconductor, Inc. - SIP-ASRNXS002

KEY Part #: K7346477

SIP-ASRNXS002 Utu (USD) [410Stock Ngahau]

1 pcs$123.99174
10 pcs$121.19250
25 pcs$116.53135

Te waahanga waahanga:: SIP-ASRNXS002

Kaihanga:: Samsung Semiconductor, Inc.

Whakaahuatanga Taipitopito:: 5 INCH MIPI LCD.

Ko te wa kaiarahi paerewa a te kaihanga:: I roto i te taonga

Te whare noho:: Kotahi Tau

Chip Mai:: Hong Kong

RoHS:

Te tikanga utu:

Te ara kaipuke:

Ngā Kāwai Whānau:: KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Poari Aromātai - Huihuinga ki te Tahuri Mamati (AD, Kaari Aromātai - Nga Aara, Poari Aromātai - Poari Whakawhitinga, Kaute Wahine, Poari Aromātai - Huihuinga ki te Tahuri Mamati (AD, Poari Aromātai - Kaitohu Taumaha Raina, Pūmanawa, Ratonga, Poari Aromātai - Amplifiers Audio and Poari Aromātai - Whakauruhia - Maatauranga Huinga ...

Whakapai Tinana:: We specialize in Samsung Semiconductor, Inc. SIP-ASRNXS002 electronic components. SIP-ASRNXS002 can be shipped within 24 hours after order. If you have any demands for SIP-ASRNXS002, Please submit a Request for Quotation here or send us an email: rfq@key-components.com

GB-T-27922

ISO-9001-2015

ISO-13485

ISO-14001

ISO-28000-2007

ISO-45001-2018

SIP-ASRNXS002 Nga Hua Hua

Te waahanga waahanga : SIP-ASRNXS002

Kaihanga : Samsung Semiconductor, Inc.

Whakaahuatanga : 5 INCH MIPI LCD

Toa : ARTIK

Wāhanga wahi : Active

Pūhara : ARTIK

Momo : Display

Mahinga : LCD Touchscreen 5"

Whakamahi IC / Wahanga : mXT540S

Pukapuka : Board(s)

Nga Pūrongo Hou

Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology

Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones

Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor

Bringing Artificial Intelligence to Devices Everywhere

The future of NAND technology

Samsung Now Mass Producing Industry’s Most Advanced 4Gb DDR3, Using 20 Nanometer Process Technology

Inside the building blocks of the 5G future

Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards

[Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions

Samsung Electronics Introduces New High Bandwidth Memory Technology Tailored to Data Centers, Graphic Applications, and AI

Evolving Mobile Solutions: Samsung at MWC 2018

Samsung Enhances Functional Safety to its Automotive Semiconductors with ISO 26262 Certification

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