60-12-D397-T500 Utu (USD) [55666Stock Ngahau]
- 1 pcs$0.70241
- Te waahanga waahanga:
- 60-12-D397-T500
- Kaihanga:
- Parker Chomerics
- Whakaahuatanga Taipitopito:
- CHO-THERM T500 TO-220 0.010 ADH.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Ahua AC, Te wera - Hoko te werawera, Te Raumati - Pads, Rau, Te wera - Te waipiro, Utu - Taonga, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Meaa and Te Raumati - Maamaa, Epoxies, Kariki, Pahi ...
- Whakapai Tinana:
- We specialize in Parker Chomerics 60-12-D397-T500 electronic components. 60-12-D397-T500 can be shipped within 24 hours after order. If you have any demands for 60-12-D397-T500, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
60-12-D397-T500 Nga Hua Hua
Te waahanga waahanga :
60-12-D397-T500
Kaihanga :
Parker Chomerics
Whakaahuatanga :
CHO-THERM T500 TO-220 0.010 ADH
Toa :
CHO-THERM® T500
Wāhanga wahi :
Active
Whakamahi :
TO-220
Momo :
Insulator Pad, Sheet
Hanga :
Rectangular
Rarangi :
21.72mm x 14.28mm
Paruparu :
0.0100" (0.254mm)
Ahumahi :
-
Whakapiri :
Adhesive - One Side
Te tuuri, kawe :
Fiberglass
Tae :
Green
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
2.1 W/m-K
Kia Korero Ma Te Korero
-
CD-02-05-C-18
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick
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THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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THERM PAD 25.4MMX25.4MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, 1 Inch x 1 Inch Square Pad, 0.003 Inch Thick
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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