Amphenol ICC (FCI) - DIP328-014BLF

KEY Part #: K3351318

[5538Stock Ngahau]


    Te waahanga waahanga:
    DIP328-014BLF
    Kaihanga:
    Amphenol ICC (FCI)
    Whakaahuatanga Taipitopito:
    CONN IC DIP SOCKET 28POS TIN.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: He Kaihono Tauhokohoko - He Tapawaha Maari, Paerew, Papaa - PC Receptacles, PC Hono, He Kaihauturu Taapuri - Nga Heihi, Nga Poraka Poto - Nga Taonga - nga Raima Taimana, He Hononga Taapuri - Hoapapa, Tūhono Taimana - Housings, Tūhono Tauira - He Hono o and Te Papainga - Waea ki nga Kaitoha Poari ...
    Whakapai Tinana:
    We specialize in Amphenol ICC (FCI) DIP328-014BLF electronic components. DIP328-014BLF can be shipped within 24 hours after order. If you have any demands for DIP328-014BLF, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    DIP328-014BLF Nga Hua Hua

    Te waahanga waahanga : DIP328-014BLF
    Kaihanga : Amphenol ICC (FCI)
    Whakaahuatanga : CONN IC DIP SOCKET 28POS TIN
    Toa : -
    Wāhanga wahi : Obsolete
    Momo : DIP, 0.3" (7.62mm) Row Spacing
    Te maha o nga tuunga me nga titi ranei (Kere) : 28 (2 x 14)
    Piita - Kaore : 0.100" (2.54mm)
    Whakawhitiwhiti ki te Oti : Tin
    Whakapā atu ki Oti Whakamutu : 100.0µin (2.54µm)
    Material Whakapā - Kaitohu : Beryllium Copper
    Momo Momo : Through Hole
    Nga Huihuinga : Open Frame
    Whakamutu : Solder
    Piita - Post : 0.100" (2.54mm)
    Whakawhitihia te Whakaputa - Post : Tin
    Whakapā atu ki Oti Whakamutu : 200.0µin (5.08µm)
    Material Whakapā - Puku : Brass
    Whare Papainga : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
    Taumaha Mahi : -

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