60-12-20268-TW10 Utu (USD) [27028Stock Ngahau]
- 1 pcs$1.52482
- Te waahanga waahanga:
- 60-12-20268-TW10
- Kaihanga:
- Parker Chomerics
- Whakaahuatanga Taipitopito:
- T-WING HEAT SPREADER 4X1X1 ADH.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te wera - Hoko te werawera, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Whanau - Taonga - Raea Fan, Te Raumati - Thermoelectric, Peltier Assemblies, Te wera - Te waipiro, Ahua AC, Utu - Taonga and Te Werawera - Meaa ...
- Whakapai Tinana:
- We specialize in Parker Chomerics 60-12-20268-TW10 electronic components. 60-12-20268-TW10 can be shipped within 24 hours after order. If you have any demands for 60-12-20268-TW10, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
60-12-20268-TW10 Nga Hua Hua
Te waahanga waahanga :
60-12-20268-TW10
Kaihanga :
Parker Chomerics
Whakaahuatanga :
T-WING HEAT SPREADER 4X1X1 ADH
Toa :
T-WING®
Wāhanga wahi :
Active
Whakamahi :
-
Momo :
Heat Spreading Tape
Hanga :
Rectangular
Rarangi :
101.60mm x 25.40mm
Paruparu :
0.0130" (0.330mm)
Ahumahi :
Silicone
Whakapiri :
Adhesive - Both Sides
Te tuuri, kawe :
-
Tae :
Black
Whanatau Whakahohaetanga :
20.00°C/W
Te Whanonga Haumaru :
-
Kia Korero Ma Te Korero
-
PL-2-1-254
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THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
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CD-02-05-C-18
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
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THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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CD-02-05-REC-125-N
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THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
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