Amphenol ICC (FCI) - DIP628-001BLF

KEY Part #: K3351335

[5516Stock Ngahau]


    Te waahanga waahanga:
    DIP628-001BLF
    Kaihanga:
    Amphenol ICC (FCI)
    Whakaahuatanga Taipitopito:
    CONN IC DIP SOCKET 28POS GOLD.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Kaitono LGH, Te Patu - Kuhu, Tūhono Taimana - Hoapā, Paetukutuku Rectangular - Hoapapa, Tūhono Tono - Taputapu, D-Sub, Kaihono-D Whakauru - Housings, D-Sub, Kaihono-D Whakawhitihia - Taputapu - Jacksc and I waenga i nga Pukapuka Tohu ...
    Whakapai Tinana:
    We specialize in Amphenol ICC (FCI) DIP628-001BLF electronic components. DIP628-001BLF can be shipped within 24 hours after order. If you have any demands for DIP628-001BLF, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    DIP628-001BLF Nga Hua Hua

    Te waahanga waahanga : DIP628-001BLF
    Kaihanga : Amphenol ICC (FCI)
    Whakaahuatanga : CONN IC DIP SOCKET 28POS GOLD
    Toa : -
    Wāhanga wahi : Obsolete
    Momo : DIP, 0.6" (15.24mm) Row Spacing
    Te maha o nga tuunga me nga titi ranei (Kere) : 28 (2 x 14)
    Piita - Kaore : 0.100" (2.54mm)
    Whakawhitiwhiti ki te Oti : Gold
    Whakapā atu ki Oti Whakamutu : 30.0µin (0.76µm)
    Material Whakapā - Kaitohu : Beryllium Copper
    Momo Momo : Through Hole
    Nga Huihuinga : Open Frame
    Whakamutu : Solder
    Piita - Post : 0.100" (2.54mm)
    Whakawhitihia te Whakaputa - Post : Tin
    Whakapā atu ki Oti Whakamutu : 200.0µin (5.08µm)
    Material Whakapā - Puku : Brass
    Whare Papainga : Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
    Taumaha Mahi : -

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