ATS-61330W-C1-R0 Utu (USD) [6942Stock Ngahau]
- 1 pcs$5.93623
- 10 pcs$5.65462
- 25 pcs$5.30127
- 50 pcs$5.12455
- 100 pcs$4.70042
- 250 pcs$4.41768
- 500 pcs$4.32933
- 1,000 pcs$4.31166
- Te waahanga waahanga:
- ATS-61330W-C1-R0
- Kaihanga:
- Advanced Thermal Solutions Inc.
- Whakaahuatanga Taipitopito:
- MAXIGRIP FANSINK 33X33X24.5MM. Heat Sinks BGA fanSINK Assembly with maxiGRIP Attachment, High Performance, 32.25x32.25x24.5mm, 32.25mm dia.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Meaa, Te Werawera - Thermoelectric, Peltier Modules, Te Raumati - Thermoelectric, Peltier Assemblies, Te wera - Te waipiro, Ahua AC, Te wera - Hoko te werawera and Te Raumati - Pads, Rau ...
- Whakapai Tinana:
- We specialize in Advanced Thermal Solutions Inc. ATS-61330W-C1-R0 electronic components. ATS-61330W-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-61330W-C1-R0, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
ATS-61330W-C1-R0 Nga Hua Hua
Te waahanga waahanga :
ATS-61330W-C1-R0
Kaihanga :
Advanced Thermal Solutions Inc.
Whakaahuatanga :
MAXIGRIP FANSINK 33X33X24.5MM
Toa :
fanSINK, maxiGRIP
Wāhanga wahi :
Discontinued at Digi-Key
Momo :
Top Mount
Paetene :
BGA
Tikanga whakapiri :
Clip, Thermal Material
Hanga :
Square, Pin Fins
Te roanga :
1.299" (32.99mm)
Whanui :
1.299" (32.99mm)
Raimana :
-
Te Runga Matua (Te Runga o te Fin) :
0.965" (24.50mm)
Te Whakamutunga Kaha @ Whakarewa :
-
Te Ururua Raumati @ Whakahaerehia Ma Te Hau :
1.55°C/W @ 200 LFM
Te Maawerawera Rererangi @ Tinana :
-
Ahumahi :
Aluminum
He Oti Taonga :
Black Anodized
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
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HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x228.6mm
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-
511-12U
Wakefield-Vette
HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x304.8mm
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