Advanced Thermal Solutions Inc. - ATS-59009-C1-R0

KEY Part #: K6263915

ATS-59009-C1-R0 Utu (USD) [4005Stock Ngahau]

  • 1 pcs$9.17334
  • 10 pcs$8.66278
  • 25 pcs$7.75561
  • 50 pcs$7.27084
  • 100 pcs$6.78612
  • 250 pcs$6.30138
  • 500 pcs$6.18020

Te waahanga waahanga:
ATS-59009-C1-R0
Kaihanga:
Advanced Thermal Solutions Inc.
Whakaahuatanga Taipitopito:
HEAT SINK 62MM X 52MM X 13MM. Heat Sinks maxiGRIP Heatsink Assembly, Double-Sided Adhesive, Black-Anodized, T412, 42.5mm Comp, 62x52x13mm
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Meaa, Ahua AC, Te Werawera - Thermoelectric, Peltier Modules, Te Raumati - Pads, Rau, DC Fans, Utu - Taonga and Te wera - Hoko te werawera ...
Whakapai Tinana:
We specialize in Advanced Thermal Solutions Inc. ATS-59009-C1-R0 electronic components. ATS-59009-C1-R0 can be shipped within 24 hours after order. If you have any demands for ATS-59009-C1-R0, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

ATS-59009-C1-R0 Nga Hua Hua

Te waahanga waahanga : ATS-59009-C1-R0
Kaihanga : Advanced Thermal Solutions Inc.
Whakaahuatanga : HEAT SINK 62MM X 52MM X 13MM
Toa : maxiGRIP
Wāhanga wahi : Active
Momo : Top Mount
Paetene : Flip Chip Processors
Tikanga whakapiri : Clip
Hanga : Rectangular, Fins
Te roanga : 2.441" (62.00mm)
Whanui : 2.047" (52.00mm)
Raimana : -
Te Runga Matua (Te Runga o te Fin) : 0.512" (13.00mm)
Te Whakamutunga Kaha @ Whakarewa : -
Te Ururua Raumati @ Whakahaerehia Ma Te Hau : 3.20°C/W @ 200 LFM
Te Maawerawera Rererangi @ Tinana : -
Ahumahi : Aluminum
He Oti Taonga : Black Anodized

Kia Korero Ma Te Korero
  • 512-12U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 182.88x304.8mm

  • 511-3U

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Non-Milled Base, 132.33x76.2mm

  • 510-6M

    Wakefield-Vette

    HEATSINK FOR PWR MOD/IGBT/RELAY. Heat Sinks High Fin Density Heatsinks for Power Modules, IGBTs, Relays, Milled Base, 187.452x152.4mm

  • 392-300AB

    Wakefield-Vette

    HI-POWER HEATSINK SSR/IGBT/POWER. Heat Sinks High Performance Heatsink for Power Modules, IGBTs and Solid State Relays, Aluminum, Black Anodized, 300mm

  • TG-CJ-LI-43-43-6-PF

    t-Global Technology

    HEATSINK CER 43X43X6MM W/TAPE.

  • PH3N-50.8-12.7-0.07-1A

    t-Global Technology

    PH3N NANO 50.8X12.07X0.07MM.