SP600-05 Utu (USD) [131719Stock Ngahau]
- 1 pcs$0.28080
- 10 pcs$0.24996
- 50 pcs$0.22417
- 100 pcs$0.19830
- 500 pcs$0.17244
- 1,000 pcs$0.12933
- 5,000 pcs$0.11208
- Te waahanga waahanga:
- SP600-05
- Kaihanga:
- Bergquist
- Whakaahuatanga Taipitopito:
- THERM PAD 41.91MMX28.96MM GREEN.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Raumati - Pads, Rau, Te Werawera - Thermoelectric, Peltier Modules, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Whanau - Taonga - Raea Fan, Utu - Taonga, Ahua AC and Te wera - Hoko te werawera ...
- Whakapai Tinana:
- We specialize in Bergquist SP600-05 electronic components. SP600-05 can be shipped within 24 hours after order. If you have any demands for SP600-05, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
SP600-05 Nga Hua Hua
Te waahanga waahanga :
SP600-05
Kaihanga :
Bergquist
Whakaahuatanga :
THERM PAD 41.91MMX28.96MM GREEN
Toa :
Sil-Pad® 600
Wāhanga wahi :
Active
Whakamahi :
TO-3
Momo :
Pad, Sheet
Hanga :
Rhombus
Rarangi :
41.91mm x 28.96mm
Paruparu :
0.0090" (0.229mm)
Ahumahi :
Silicone Elastomer
Whakapiri :
-
Te tuuri, kawe :
-
Tae :
Green
Whanatau Whakahohaetanga :
0.35°C/W
Te Whanonga Haumaru :
1.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-3-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GREEN. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 3 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Green
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CD-02-05-C-18
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-220
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THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick
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CD-02-05-220-N
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THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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CD-02-05-C-34
Wakefield-Vette
THERM PAD 1.319 X 1.319. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 1.319 Inch x 1.319 Inch, No Hole
-
CD-02-05-247-N
Wakefield-Vette
THERM PAD TO-247 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-247 Pad, No Hole
Nga Wahanga Panu
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- A15896-18
- A15996-13
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- A14950-20
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- DC0040/06-PC99-0.06
- DC0041/01-PC99-0.06
- DC0038/03-PC99AL-0.1
- TG4040S-150-150-1.0-0
- TG4040S-150-150-5.0-0
- TG4040S-300-300-1.0-0
- TG2030S-300-300-5.0-0
- TG2030S-100-100-1.0-0
- PC99AL-100-100-0.1-0
- DC0022/03-PC99-0.06
- DC0022/02-PC99-0.06
- DC0022/01-PC99-0.06
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- GPVOU-0.080-01-0816
- A16365-18
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- A16365-08
- A16365-06
- A16365-02
- A16364-05
- A15896-16
- A14162-33
- EYG-A121810A
- DC0037/01-PCAL-0.1
- TG2030S-300-300-1.0-0
- A14162-37
- A10113-80
- SPK4-0.006-00-70
- SP900S-0.009-00-25
- SP1000-0.009-AC-43