Rongo Wae Hiko
At this year's MWC in Barcelona, Samsung Semiconductor exhibited its latest solutions and products for mobile applications
Date: 2019-11-22Reference server design guidelines for NGSFF SSD from Samsung describing Mission Peak architecture and other details.
Date: 2019-11-22Watch the video to check out Samsung NF1 SSD, small form factor that has high capacity and compatibility.
Date: 2019-11-22Greater memory will be a critical part of the design and implementation of 5G networks. To address the advanced memory needs of 5G networks, Samsung offers a growing array of products.
Date: 2019-11-22Watch the video below to check out Samsung Z-SSD, an SSD that boasts a new level of performance.
Date: 2019-11-22Samsung Z-SSD SZ985, a new type of Ultra-low Latency SSD for Enterprise and Data Centers
Date: 2019-11-22Samsung announced today that 46 of its new product innovations have been recognized as CES® 2020 Innovation Awards winners, including three Best of Innovations accolades.
Date: 2019-11-22Samsung’s new 256Gb V-NAND features industry’s fastest data transfer speed, while being the first to apply the ‘Toggle DDR 4.0’ NAND interface
Date: 2019-11-22New V-NAND breaks through current cell stacking limitation in 3D NAND with the industry's first 100+ layer single-tier design for superior speed and power efficiency.
Date: 2019-11-22The revolutionary flash technology, the sixth-generation V-NAND is perfectly suited for today’s and tomorrow’s data demands.
Date: 2019-11-22Samsung’s PCI Gen4-based SSD with three core software technologies will help enterprises and service providers harness the power of future technological innovations.
Date: 2019-11-22Samsung Electronics Co.. Ltd.. a global leader in advanced semiconductor technology solutions. has begun mass producing the industry’s first two gigabyte (GB). low power double-data-rate 3 (LPDDR3) memory. using 30 nanometer (nm) class* technology. for next-generation mobile devices.
Date: 2019-11-22Samsung Electronics Co.. Ltd.. the world leader in advanced memory technology. today announced the industry's first production of ultra-high-speed four gigabit (Gb) low power double data rate 3 (LPDDR3) mobile DRAM. which is being produced at a 20 nanometer (nm) class* process node.
Date: 2019-11-22the world leader in advanced memory technology. today announced the industry’s first mass production of three gigabyte (GB) low power double data rate 3 (LPDDR3) mobile DRAM. the highest density mobile memory solution for next-generation smartphones. which will bring a generation shift to the market from the 2GB packages that are widely used in current mobile devices
Date: 2019-11-22Samsung Electronics Co.. Ltd.. the world leader in advanced memory technology. announced today that it has begun mass producing its six gigabit (Gb) low-power double data rate 3 (LPDDR3) mobile DRAM.
Date: 2019-11-22Samsung Electronics Co.. Ltd.. announced today that it is mass producing the industry’s first 12-gigabit (Gb) LPDDR4 (low power. double data rate 4) mobile DRAM. based on its advan
Date: 2019-11-22Samsung introducing the industry’s first 8-gigabyte (GB) LPDDR4 (low power. double data rate 4) mobile DRAM package
Date: 2019-11-22The new 3-stack ISOCELL Fast 2L3 with integrated DRAM supports super-slow motion, low-light shooting, real-time HDR imaging, while minimizing picture distortion
Date: 2019-11-22Discover Samsung's semiconductor solutions that are used in a wide array of automotive applications.
Date: 2019-11-22Utilizing the industry's first 24Gb LPDDR4X chips, this highest-capacity uMCP makes 10+ GB memory solutions available to mid-market smartphone users.
Date: 2019-11-22Kaihanga
- Broadcom Limited
- DFRobot
- Analog Devices, Inc.
- Abracon LLC.
- Bourns
- Arduino
- ams
- Cypress Semiconductor
- Cincon
- Adafruit
- AVX Corporation
- Cree
- Azoteq
- B&K Precision
- Apacer
- 4D Systems
- Bulgin
- Antenova
- APEM
- Adesto Technologies
- CEL (California Eastern Laboratories)
- Cosel Co Ltd
- Bel
- Advanced Thermal Solutions, Inc.
- B+B SmartWorx, Inc.
- Alorium Technology
- Apex Tool Group
- 3M
- Alliance Memory, Inc.
- Bud Industries, Inc.
- Alpha Wire
- Bivar, Inc.
- Advantech
- Belden
- Carling Technologies
- CONEC
- Bridgetek
- American Technical Ceramics
- Altech Corporation
- API Delevan
- Aavid
- Ametherm
- Amprobe
- Critical Link
- Bluetechnix GmbH
- Bergquist
- Desco
- Artesyn Embedded Technologies
- Delta Electronics
- Crystek Corporation
- Sigma Designs
- Crouzet
- Comchip Technology
- Alpha and Omega Semiconductor, Inc.
- Amphenol Anytek
- Amphenol Information Communication & Commercial
- Precision Design Associates, Inc.
- Future Designs, Inc.
- Advanced Linear Devices, Inc.
- CUI
- Advanced Photonix
- Amphenol NEXUS Technologies
- SWITCHCRAFT®
- Amphenol Advanced Sensors
- Cornell Dubilier
- Capital Advanced Technologies, Inc.
- Amphenol SV Microwave
- Amphenol Aerospace Operations
- Amphenol LTW
- Amphenol RF
- CTS Electronic Components
- Amphenol Spectra-Strip
- Bosch Sensortec
- Amphenol Industrial Operations
- Cherry Americas
- Davies Molding, LLC.
- ZF Electronics
- Amphenol PCD
- Coto Technology
- Amphenol-Tuchel | Amphenol Sine Systems | Amphenol Entertainment
- ABLIC U.S.A. Inc.
- Bosch Connected Devices and Solutions
- Delta Electronics / Industrial Automation