Wakefield-Vette ulTIMiFlux Thermal Material
Wakefield-Vette ulTIMiFlux Thermal Material offers high performance, low cost, configurability and custom sizes for thermal system needs. Thermal Interface Materials (TIM) are a secondary material installed between the heat sink and the device that are designed to improve the thermal transfer to the heat sink.
Features
Low thermal impedanceExcellent replacement for Thermal GreasesThixotropic / prevents compound run-outExcellent mechanical and dielectric propertiesCost effective "drop in place" solutionRoHS and halogen-free compliant
Wakefield Newest
Wakefield-Vette LQxC Series quick disconnect couplings provide ultra-reliable, dripless connections and disconnections that protect valuable electronics.
Date: 2019-09-24Wakefield-Vette 690 series extruded heat sinks for TO devices with clip are heat sinks designed for TO-126, TO-220, and TO-247 devices.
Date: 2019-04-18Wakefield-Vette RAPID CPU Coolers are designed to draw heat away from the system CPU and other components in an enclosure.
Date: 2019-03-01Wakefield-Vette SKV Skived Fin Heat Sinks are the alternatives to extruded heat sinks considering the fin density, which cannot be achieved by extrusion technology.
Date: 2019-03-01Wakefield-Vette RAPID CPU Liquid Coolers are designed to draw heat away from the system CPU and other components in an enclosure.
Date: 2019-02-13Wakefield-Vette TECA Air-to-Air Thermoelectric Cooler Assemblies are usually used to cool (or heat) objects in enclosures.
Date: 2018-12-11Wakefield-Vette 960 Series Plastic Push Pin Heat Sinks feature pre-assembled plastic push pins with a flexible barb that engage precisely with PCB holes.
Date: 2018-12-11Wakefield-Vette TEC Series Thermoelectric Cooler Modules meet requirements of higher currents and larger cooling.
Date: 2018-12-11