PL-2-5-254-H Utu (USD) [24740Stock Ngahau]
- 1 pcs$1.66585
- 10 pcs$1.62222
- 25 pcs$1.57841
- 50 pcs$1.49062
- 100 pcs$1.40297
- 250 pcs$1.31530
- 500 pcs$1.27145
- 1,000 pcs$1.08146
- Te waahanga waahanga:
- PL-2-5-254-H
- Kaihanga:
- Wakefield-Vette
- Whakaahuatanga Taipitopito:
- THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Raumati - Thermoelectric, Peltier Assemblies, Te Raumati - Pads, Rau, Utu - Taonga, Te Werawera - Meaa, DC Fans and Whanau - Taonga - Raea Fan ...
- Whakapai Tinana:
- We specialize in Wakefield-Vette PL-2-5-254-H electronic components. PL-2-5-254-H can be shipped within 24 hours after order. If you have any demands for PL-2-5-254-H, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
PL-2-5-254-H Nga Hua Hua
Te waahanga waahanga :
PL-2-5-254-H
Kaihanga :
Wakefield-Vette
Whakaahuatanga :
THERM PAD 25.4MMX25.4MM GOLD
Toa :
ulTIMiFlux™
Wāhanga wahi :
Active
Whakamahi :
-
Momo :
Gap Filler Pad, Sheet
Hanga :
Square
Rarangi :
25.40mm x 25.40mm
Paruparu :
0.0790" (2.000mm)
Ahumahi :
Silicone Elastomer
Whakapiri :
Tacky - One Side
Te tuuri, kawe :
-
Tae :
Gold
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
5.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Nga Wahanga Panu
- A15896-17
- A14561-02
- GP3500ULM--0.125-12-0816
- A15896-11
- A15996-07
- A14565-01
- PC99-100-100-0.06-0
- T69-305-305-0.040
- T69-295-295-0.040-1A
- 5519S-2MIL
- A14696-05
- DC0040/10-PC99AL-0.1
- DC0036/04-PC99-0.06
- DC0039/01-PC99-0.06
- DC0038/07-PC99AL-0.1
- DC0038/04-PC99-0.06
- TG2030S-320-320-2.0-0
- TG4040S-150-150-3.0-0
- T68-2C-120-90-0.05
- PC99AL-100-100-0.1-0
- PC99-100-100-0.12-0
- DC0001/06-PC99-0.06
- PC94-150-150-0.25-0
- PC99AL-150-150-0.1-0
- GPVOU-0.125-01-0816
- GPVOU-0.040-01-0816
- A16365-08
- A16365-04
- A15641-08
- A16017-19
- EYG-A121803S
- 5519S 210 MM X 155 MM X 1.5 MM
- TP03
- EYG-M091210SS
- CPU 1.75X1.75
- A16365-20
- A10113-80
- SPK4-0.006-00-1212
- 5519S 210 MM X 155 MM X 0.5 MM
- Q3-0.005-00-11