SP600-114 Utu (USD) [198981Stock Ngahau]
- 1 pcs$0.18588
- 10 pcs$0.16730
- 50 pcs$0.15013
- 100 pcs$0.13281
- 500 pcs$0.11549
- 1,000 pcs$0.08661
- 5,000 pcs$0.07507
- Te waahanga waahanga:
- SP600-114
- Kaihanga:
- Bergquist
- Whakaahuatanga Taipitopito:
- THERM PAD 24MMX21.01MM GREEN.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Thermoelectric, Peltier Assemblies, Whanau - Taonga - Raea Fan, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, DC Fans, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Utu - Taonga, Te Werawera - Thermoelectric, Peltier Modules and Ahua AC ...
- Whakapai Tinana:
- We specialize in Bergquist SP600-114 electronic components. SP600-114 can be shipped within 24 hours after order. If you have any demands for SP600-114, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
SP600-114 Nga Hua Hua
Te waahanga waahanga :
SP600-114
Kaihanga :
Bergquist
Whakaahuatanga :
THERM PAD 24MMX21.01MM GREEN
Toa :
Sil-Pad® 600
Wāhanga wahi :
Active
Whakamahi :
TO-218, TO-220, TO-247
Momo :
Pad, Sheet
Hanga :
Rectangular
Rarangi :
24.00mm x 21.01mm
Paruparu :
0.0090" (0.229mm)
Ahumahi :
Silicone Elastomer
Whakapiri :
-
Te tuuri, kawe :
-
Tae :
Green
Whanatau Whakahohaetanga :
0.35°C/W
Te Whanonga Haumaru :
1.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Nga Wahanga Panu
- A15996-15
- A15996-13
- A15896-13
- A14950-19
- A14573-01
- A14950-09
- A14561-01
- GP3500ULM--0.020-12-0816
- T69-225-225-0.025-1A
- A15421-15
- DC0040/09-PC99-0.06
- DC0036/04-PC99AL-0.1
- DC0041/04-PC99AL-0.1
- DC0039/06-PC99-0.06
- DC0038/03-PC99AL-0.1
- TG2030S-150-150-3.0-0
- TG2030S-150-150-2.0-0
- TG4040S-320-320-5.0-0
- T68-2A-120-90-0.07
- T68-1B-120-90-0.02
- PC99P-100-100-0.1-0
- A16365-07
- A16365-02
- A16365-03
- A14162-23
- A14162-27
- EYG-A121810A
- 5595 210 MM X 300 MM 2.0 MM
- EYG-A060910B
- EYG-A091210P
- DC0040/09-PC99AL-0.1
- DC0040/01-PC99AL-0.1
- DC0037/01-PCAL-0.1
- SPA2000-0.020-AC-104
- SP400-0.007-00-94
- SPK10-0.006-00-34
- SP1000-0.009-00-90
- SP400-0.009-00-22
- SP400-0.009-00-10
- SP900S-0.009-00-25