Keystone Electronics - 4636

KEY Part #: K6153230

4636 Utu (USD) [584508Stock Ngahau]

  • 1 pcs$0.07514
  • 10 pcs$0.07119
  • 50 pcs$0.04540
  • 100 pcs$0.04386
  • 250 pcs$0.03783
  • 500 pcs$0.03777
  • 1,000 pcs$0.03177
  • 2,500 pcs$0.02874
  • 5,000 pcs$0.02723

Te waahanga waahanga:
4636
Kaihanga:
Keystone Electronics
Whakaahuatanga Taipitopito:
THERM PAD 42.04MMX27MM. Mounting Hardware TO3 MICA INSULATOR
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Werawera - Meaa, Te Raumati - Thermoelectric, Peltier Assemblies, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te wera - Te waipiro, DC Fans, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Ahua AC and Te wera - Hoko te werawera ...
Whakapai Tinana:
We specialize in Keystone Electronics 4636 electronic components. 4636 can be shipped within 24 hours after order. If you have any demands for 4636, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

4636 Nga Hua Hua

Te waahanga waahanga : 4636
Kaihanga : Keystone Electronics
Whakaahuatanga : THERM PAD 42.04MMX27MM
Toa : -
Wāhanga wahi : Active
Whakamahi : TO-3
Momo : Die-Cut Pad, Sheet
Hanga : Rhombus
Rarangi : 42.04mm x 27.00mm
Paruparu : 0.0030" (0.076mm)
Ahumahi : Mica
Whakapiri : -
Te tuuri, kawe : -
Tae : -
Whanatau Whakahohaetanga : -
Te Whanonga Haumaru : -

Kia Korero Ma Te Korero
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-264

    Wakefield-Vette

    THERM PAD 26.67MMX21.59MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-264 Pad, 0.003 Inch Thick

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft