OTH-Q81771C-00-DN5 Utu (USD) [564878Stock Ngahau]
- 1 pcs$0.20050
- 9 pcs$0.19951
- 18 pcs$0.18984
- 27 pcs$0.18032
- 63 pcs$0.17559
- 225 pcs$0.17323
- 450 pcs$0.16136
- 900 pcs$0.15187
- Te waahanga waahanga:
- OTH-Q81771C-00-DN5
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 10MMX10MM GRAY.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te wera - Te waipiro, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Werawera - Thermoelectric, Peltier Modules, Ahua AC, Te Raumati - Pads, Rau, Te wera - Hoko te werawera, Utu - Taonga and DC Fans ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials OTH-Q81771C-00-DN5 electronic components. OTH-Q81771C-00-DN5 can be shipped within 24 hours after order. If you have any demands for OTH-Q81771C-00-DN5, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
OTH-Q81771C-00-DN5 Nga Hua Hua
Te waahanga waahanga :
OTH-Q81771C-00-DN5
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 10MMX10MM GRAY
Toa :
Tpcm™ 580
Wāhanga wahi :
Active
Whakamahi :
-
Momo :
Phase Change Pad, Sheet
Hanga :
Square
Rarangi :
10.00mm x 10.00mm
Paruparu :
0.0080" (0.203mm)
Ahumahi :
Phase Change Compound
Whakapiri :
Tacky - Both Sides
Te tuuri, kawe :
-
Tae :
Gray
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
3.8 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
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