A15996-05 Utu (USD) [830Stock Ngahau]
- 1 pcs$56.16471
- 4 pcs$55.88528
- Te waahanga waahanga:
- A15996-05
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 228.6MMX228.6MM GRAY.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: DC Fans, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te wera - Hoko te werawera, Te wera - Te waipiro, Ahua AC, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Werawera - Thermoelectric, Peltier Modules and Te Raumati - Thermoelectric, Peltier Assemblies ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials A15996-05 electronic components. A15996-05 can be shipped within 24 hours after order. If you have any demands for A15996-05, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A15996-05 Nga Hua Hua
Te waahanga waahanga :
A15996-05
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 228.6MMX228.6MM GRAY
Toa :
Tflex™ 700
Wāhanga wahi :
Not For New Designs
Whakamahi :
-
Momo :
Gap Filler Pad, Sheet
Hanga :
Square
Rarangi :
228.60mm x 228.60mm
Paruparu :
0.0500" (1.270mm)
Ahumahi :
Silicone
Whakapiri :
Tacky - One Side
Te tuuri, kawe :
-
Tae :
Gray
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
5.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
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THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-126
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THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
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CD-02-05-C-20
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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CD-02-05-REC-125-N
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THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
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