t-Global Technology - DC0011/08-TI900-0.12-2A

KEY Part #: K6153177

DC0011/08-TI900-0.12-2A Utu (USD) [239798Stock Ngahau]

  • 1 pcs$0.15424
  • 10 pcs$0.14792
  • 25 pcs$0.14064
  • 50 pcs$0.13700
  • 100 pcs$0.13510
  • 250 pcs$0.12586
  • 500 pcs$0.11846
  • 1,000 pcs$0.10735
  • 5,000 pcs$0.10365

Te waahanga waahanga:
DC0011/08-TI900-0.12-2A
Kaihanga:
t-Global Technology
Whakaahuatanga Taipitopito:
THERM PAD 19.05MMX12.7MM W/ADH.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: DC Fans, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Raumati - Thermoelectric, Peltier Assemblies, Te Werawera - Thermoelectric, Peltier Modules, Te Werawera - Meaa, Utu - Taonga, Ahua AC and Te Raumati - Pads, Rau ...
Whakapai Tinana:
We specialize in t-Global Technology DC0011/08-TI900-0.12-2A electronic components. DC0011/08-TI900-0.12-2A can be shipped within 24 hours after order. If you have any demands for DC0011/08-TI900-0.12-2A, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

DC0011/08-TI900-0.12-2A Nga Hua Hua

Te waahanga waahanga : DC0011/08-TI900-0.12-2A
Kaihanga : t-Global Technology
Whakaahuatanga : THERM PAD 19.05MMX12.7MM W/ADH
Toa : Ti900
Wāhanga wahi : Active
Whakamahi : TO-220
Momo : Die-Cut Pad, Sheet
Hanga : Rectangular
Rarangi : 19.05mm x 12.70mm
Paruparu : 0.0050" (0.127mm)
Ahumahi : Silicone
Whakapiri : Adhesive - Both Sides
Te tuuri, kawe : Viscose
Tae : White
Whanatau Whakahohaetanga : -
Te Whanonga Haumaru : 1.8 W/m-K

Kia Korero Ma Te Korero
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft