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  1. Whare
  2. Nga Hua
  3. DRAM
  4. DDR3
  5. K4B4G0846R-BFMA

Samsung Semiconductor - K4B4G0846R-BFMA

KEY Part #: K7359685

[17141Stock Ngahau]

    Te waahanga waahanga:
    K4B4G0846R-BFMA
    Kaihanga:
    Samsung Semiconductor
    Whakaahuatanga Taipitopito:
    4 Gb 512M x 8 1866 Mbps 1.35 V -40 ~ 95 °C 78FBGA Mass Production.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: GDDR5, LPDDR4, GDDR6, DDR4, LPDDR3, LPDDR4X, HBM Aquabolt and SLC Nand ...
    Whakapai Tinana:
    We specialize in Samsung Semiconductor K4B4G0846R-BFMA electronic components. K4B4G0846R-BFMA can be shipped within 24 hours after order. If you have any demands for K4B4G0846R-BFMA, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K4B4G0846R-BFMA Nga Hua Hua

    Te waahanga waahanga : K4B4G0846R-BFMA
    Kaihanga : Samsung Semiconductor
    Whakaahuatanga : 4 Gb 512M x 8 1866 Mbps 1.35 V -40 ~ 95 °C 78FBGA Mass Production
    Toa : DDR3
    kiato : 4 Gb
    Org. : 512M x 8
    tere : 1866 Mbps
    ngaohiko : 1.35 V
    Temp. : -40 ~ 95 °C
    mōkī : 78FBGA
    Tūnga hua : Mass Production

    Nga Pūrongo Hou

    Samsung’s Newest ISOCELL Image Sensor Enables Mobile Devices to ‘Slow Down’ Time
    Autonomous Driving and the Quest for Safety
    Inside the building blocks of the 5G future
    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
    High Bandwidth Memory is Catching on for Data-intensive Computing
    SSDs, DRAM and gaming: Unlocking a new level of performance
    Unlocking the Power of Cloud Computing
    5G and Memory - from Connected Thinking to Connected Living
    Samsung Announces Production of Industry’s First 2GB LPDDR3 Mobile Memory, Using 30nm-class Technology
    The future of NAND technology
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    Samsung Honored for Outstanding Design and Engineering with 36 CES 2018 Innovation Awards
    Kia Korero Ma Te Korero
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    Nga Wahanga Panu