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  1. Whare
  2. Nga Hua
  3. DRAM
  4. LPDDR4X
  5. K3UH7H70AM-AGCL

Samsung Semiconductor - K3UH7H70AM-AGCL

KEY Part #: K7359732

[15491Stock Ngahau]

    Te waahanga waahanga:
    K3UH7H70AM-AGCL
    Kaihanga:
    Samsung Semiconductor
    Whakaahuatanga Taipitopito:
    64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: LPDDR3, LPDDR4X, DDR3, MODULE, HBM Flarebolt, GDDR5, DDR4 and LPDDR5 ...
    Whakapai Tinana:
    We specialize in Samsung Semiconductor K3UH7H70AM-AGCL electronic components. K3UH7H70AM-AGCL can be shipped within 24 hours after order. If you have any demands for K3UH7H70AM-AGCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K3UH7H70AM-AGCL Nga Hua Hua

    Te waahanga waahanga : K3UH7H70AM-AGCL
    Kaihanga : Samsung Semiconductor
    Whakaahuatanga : 64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 556FBGA Mass Production
    Toa : DDR3
    kiato : 64 Gb
    Org. : x64
    tere : 4266 Mbps
    ngaohiko : 1.8 / 1.1 / 0.6 V
    Temp. : -25 ~ 85 °C
    mōkī : 556FBGA
    Tūnga hua : Mass Production

    Nga Pūrongo Hou

    Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones
    Mass Production of Fifth-Generation V-NAND has Started
    Mission Peak Reference Server System for NGSFF SSD
    The future of NAND technology
    Samsung’s PM1733 SSD and High Density DIMMs Support AMD EPYC™ 7002 Series Processor
    High Bandwidth Memory is Catching on for Data-intensive Computing
    [Video] 5G memory solutions : 5G. All in the Memory.
    Evolving Mobile Solutions: Samsung at MWC 2018
    Automotive Driven by Small Packages Under the Hood
    Samsung Z-SSD SZ985
    Samsung Electronics Begins Mass Production of Industry's First 12GB LPDDR4X-based uMCP
    Samsung Now Producing Four Gigabit LPDDR3 Mobile DRAM, Using 20nm-class Process Technology
    Kia Korero Ma Te Korero
    • M378A1K43BB1-CPB

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    • M378A1K43BB2-CRC

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    • M378A1K43BB2-CTD

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2666 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

    • M378A1K43CB2-CPB

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

    • M378A1K43CB2-CRC

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

    • M378A1K43CB2-CTD

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2666 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

    Nga Wahanga Panu