t-Global Technology - L37-3-40-33-1

KEY Part #: K6153172

L37-3-40-33-1 Utu (USD) [60335Stock Ngahau]

  • 1 pcs$0.64806
  • 10 pcs$0.61712
  • 25 pcs$0.60089
  • 50 pcs$0.58467
  • 100 pcs$0.55218
  • 250 pcs$0.51970
  • 500 pcs$0.48722
  • 1,000 pcs$0.45474
  • 5,000 pcs$0.43850

Te waahanga waahanga:
L37-3-40-33-1
Kaihanga:
t-Global Technology
Whakaahuatanga Taipitopito:
THERM PAD 40MMX33MM YELLOW.
Ko te wa kaiarahi paerewa a te kaihanga:
I roto i te taonga
Te whare noho:
Kotahi Tau
Chip Mai:
Hong Kong
RoHS:
Te tikanga utu:
Te ara kaipuke:
Ngā Kāwai Whānau:
KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Utu - Taonga, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Whanau - Taonga - Raea Fan, Te Werawera - Thermoelectric, Peltier Modules, Te wera - Hoko te werawera, Te Raumati - Pads, Rau, Te Werawera - Meaa and Te wera - Te waipiro ...
Whakapai Tinana:
We specialize in t-Global Technology L37-3-40-33-1 electronic components. L37-3-40-33-1 can be shipped within 24 hours after order. If you have any demands for L37-3-40-33-1, Please submit a Request for Quotation here or send us an email:
GB-T-27922
ISO-9001-2015
ISO-13485
ISO-14001
ISO-28000-2007
ISO-45001-2018

L37-3-40-33-1 Nga Hua Hua

Te waahanga waahanga : L37-3-40-33-1
Kaihanga : t-Global Technology
Whakaahuatanga : THERM PAD 40MMX33MM YELLOW
Toa : L37-3
Wāhanga wahi : Active
Whakamahi : -
Momo : Conductive Pad, Sheet
Hanga : Rectangular
Rarangi : 40.00mm x 33.00mm
Paruparu : 0.0400" (1.016mm)
Ahumahi : Silicone Elastomer
Whakapiri : -
Te tuuri, kawe : Fiberglass
Tae : Yellow
Whanatau Whakahohaetanga : -
Te Whanonga Haumaru : 1.7 W/m-K

Kia Korero Ma Te Korero
  • PL-2-1-254

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey

  • CD-02-05-C-18

    Wakefield-Vette

    THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole

  • CD-02-05-126

    Wakefield-Vette

    THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole

  • CD-02-05-C-20

    Wakefield-Vette

    THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole

  • CD-02-05-REC-125-N

    Wakefield-Vette

    THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole

  • PL-2-5-254-H

    Wakefield-Vette

    THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft