60-11-D394-1671 Utu (USD) [31701Stock Ngahau]
- 1 pcs$1.30006
- Te waahanga waahanga:
- 60-11-D394-1671
- Kaihanga:
- Parker Chomerics
- Whakaahuatanga Taipitopito:
- CHO-THERM 1671 TO-220.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Whanau - Taonga - Raea Fan, Te Raumati - Pads, Rau, Te Werawera - Thermoelectric, Peltier Modules, Te wera - Hoko te werawera, Te wera - Te waipiro, Utu - Taonga and Te Raumati - Maamaa, Epoxies, Kariki, Pahi ...
- Whakapai Tinana:
- We specialize in Parker Chomerics 60-11-D394-1671 electronic components. 60-11-D394-1671 can be shipped within 24 hours after order. If you have any demands for 60-11-D394-1671, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
60-11-D394-1671 Nga Hua Hua
Te waahanga waahanga :
60-11-D394-1671
Kaihanga :
Parker Chomerics
Whakaahuatanga :
CHO-THERM 1671 TO-220
Toa :
CHO-THERM® 1671
Wāhanga wahi :
Active
Whakamahi :
TO-220
Momo :
Insulator Pad, Sheet
Hanga :
Rectangular
Rarangi :
19.05mm x 12.70mm
Paruparu :
0.0150" (0.381mm)
Ahumahi :
Acrylic
Whakapiri :
-
Te tuuri, kawe :
Fiberglass
Tae :
White
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
2.6 W/m-K
Kia Korero Ma Te Korero
-
CD-02-05-C-18
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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CD-02-05-126
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THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
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CD-02-05-220
Wakefield-Vette
THERM PAD 17.78MMX12.7MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, 0.003 Inch Thick
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CD-02-05-220-N
Wakefield-Vette
THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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CD-02-05-C-22
Wakefield-Vette
THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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