A14566-01 Utu (USD) [925Stock Ngahau]
- 1 pcs$50.41582
- 4 pcs$50.16499
- Te waahanga waahanga:
- A14566-01
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 228.6MMX228.6MM BLUE. Thermal Interface Products Tflex 5120 9" x 9" x 0.120"
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Pads, Rau, Te wera - Hoko te werawera, Utu - Taonga, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Ahua AC, DC Fans and Te Raumati - Thermoelectric, Peltier Assemblies ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials A14566-01 electronic components. A14566-01 can be shipped within 24 hours after order. If you have any demands for A14566-01, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A14566-01 Nga Hua Hua
Te waahanga waahanga :
A14566-01
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 228.6MMX228.6MM BLUE
Toa :
Tflex™ 500
Wāhanga wahi :
Not For New Designs
Whakamahi :
-
Momo :
Gap Filler Pad, Sheet
Hanga :
Square
Rarangi :
228.60mm x 228.60mm
Paruparu :
0.120" (3.05mm)
Ahumahi :
Silicone Elastomer
Whakapiri :
Tacky - Both Sides
Te tuuri, kawe :
-
Tae :
Blue
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
2.8 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-C-20
Wakefield-Vette
THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Nga Wahanga Panu
- A16006-08
- A15896-15
- A15796-25
- GP3500ULM--0.100-12-0816
- GPHC3.0-0.125-02-0816
- A14571-01
- A15896-06
- A14950-15
- A15896-03
- GP3000S30-0.040-02-0816-NA
- A14558-01
- A14950-02
- PC93-20-20-4-1A
- A16487-14
- DC0038/02-PC99-0.06
- DC0040/08-PC99-0.06
- DC0041/01-PC99-0.06
- TG4040S-150-150-5.0-0
- TG4040S-320-320-3.0-0
- TG4040S-100-100-5.0-0
- TG4040S-320-320-2.0-0
- TG2030S-100-100-5.0-0
- DC0011/08-PC99-0.06
- DC0022/01-PC99-0.06
- PC93-20-10-0.25
- PC93-20-20-0.25
- PC99P-150-150-0.1-0
- PC99-300-300-0.12-0
- PC99-300-300-0.06-0
- A16364-07
- A15798-00
- A14162-15
- EYG-A060910P
- GPVOU-0.100-01-0816
- K4-06
- SPK10-0.006-00-36
- SPK10-0.006-00-48
- SPK10-0.006-00-22
- Q3-0.005-00-02
- Q3-0.005-00-36