TG2030-19.50-12.70-3 Utu (USD) [115457Stock Ngahau]
- 1 pcs$0.32036
- 10 pcs$0.30454
- 25 pcs$0.28919
- 50 pcs$0.28152
- 100 pcs$0.27776
- 250 pcs$0.25872
- 500 pcs$0.24350
- 1,000 pcs$0.22067
- 5,000 pcs$0.21306
- Te waahanga waahanga:
- TG2030-19.50-12.70-3
- Kaihanga:
- t-Global Technology
- Whakaahuatanga Taipitopito:
- THERM PAD 19.50MMX12.7MM WHITE.
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Te Raumati - Pads, Rau, Te Raumati - Thermoelectric, Peltier Assemblies, Ahua AC, Utu - Taonga, Te wera - Te waipiro, Te Werawera - Nga Mumu O Te Horoi, Toto Tuuturu, Te Werawera - Thermoelectric, Peltier Modules and Whanau - Taonga - Raea Fan ...
- Whakapai Tinana:
- We specialize in t-Global Technology TG2030-19.50-12.70-3 electronic components. TG2030-19.50-12.70-3 can be shipped within 24 hours after order. If you have any demands for TG2030-19.50-12.70-3, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
TG2030-19.50-12.70-3 Nga Hua Hua
Te waahanga waahanga :
TG2030-19.50-12.70-3
Kaihanga :
t-Global Technology
Whakaahuatanga :
THERM PAD 19.50MMX12.7MM WHITE
Toa :
TG2030
Wāhanga wahi :
Active
Whakamahi :
-
Momo :
Conductive Pad, Sheet
Hanga :
Rectangular
Rarangi :
19.50mm x 12.70mm
Paruparu :
0.118" (3.00mm)
Ahumahi :
Silicone Elastomer
Whakapiri :
Tacky - Both Sides
Te tuuri, kawe :
-
Tae :
White
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
2.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
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THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
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THERM PAD TO-220 NO HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-220 Pad, No Hole
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CD-02-05-C-22
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THERM PAD 0.846 X 0.846. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.846 Inch x 0.846 Inch, No Hole
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THERM PAD 0.768 X 0.768. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.768 Inch x 0.768 Inch, No Hole
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THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
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