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  1. Whare
  2. Nga Hua
  3. DRAM
  4. LPDDR4X
  5. K3UH7H70AM-EGCL

Samsung Semiconductor - K3UH7H70AM-EGCL

KEY Part #: K7359733

[19657Stock Ngahau]

    Te waahanga waahanga:
    K3UH7H70AM-EGCL
    Kaihanga:
    Samsung Semiconductor
    Whakaahuatanga Taipitopito:
    64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production.
    Ko te wa kaiarahi paerewa a te kaihanga:
    I roto i te taonga
    Te whare noho:
    Kotahi Tau
    Chip Mai:
    Hong Kong
    RoHS:
    Te tikanga utu:
    Te ara kaipuke:
    Ngā Kāwai Whānau:
    KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: SLC Nand, MODULE, DDR4, HBM Flarebolt, GDDR6, LPDDR4X, DDR3 and HBM Aquabolt ...
    Whakapai Tinana:
    We specialize in Samsung Semiconductor K3UH7H70AM-EGCL electronic components. K3UH7H70AM-EGCL can be shipped within 24 hours after order. If you have any demands for K3UH7H70AM-EGCL, Please submit a Request for Quotation here or send us an email:
    GB-T-27922
    ISO-9001-2015
    ISO-13485
    ISO-14001
    ISO-28000-2007
    ISO-45001-2018

    K3UH7H70AM-EGCL Nga Hua Hua

    Te waahanga waahanga : K3UH7H70AM-EGCL
    Kaihanga : Samsung Semiconductor
    Whakaahuatanga : 64 Gb x64 4266 Mbps 1.8 / 1.1 / 0.6 V -25 ~ 85 °C 376FBGA Mass Production
    Toa : DDR3
    kiato : 64 Gb
    Org. : x64
    tere : 4266 Mbps
    ngaohiko : 1.8 / 1.1 / 0.6 V
    Temp. : -25 ~ 85 °C
    mōkī : 376FBGA
    Tūnga hua : Mass Production

    Nga Pūrongo Hou

    5G and Memory - from Connected Thinking to Connected Living
    Samsung Showcases Its Latest Silicon Technologies for the Next Wave of Innovation at Annual Tech Day
    [Video] The Future of Autonomous Driving: Samsung’s Memory Component Solutions
    Samsung Rolls Out Industry’s First 8GB LPDDR4 DRAM Package
    Samsung Now Producing Industry’s Highest Density (3GB) LPDDR3 Mobile Memory for Smartphones
    Mission Peak Reference Server System for NGSFF SSD
    Autonomous Driving and the Quest for Safety
    Bringing Artificial Intelligence to Devices Everywhere
    NF1 SSD, Reach New Heights with Hyper-Scalable Datacenters
    How Will 5G Impact on Memory?
    Driving the Artificial Intelligence Evolution with In-Memory Computing
    Samsung Z-SSD SZ985
    Kia Korero Ma Te Korero
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      DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

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      DDR4 UDIMM 8 GB 1R x 8 2666 Mbps 1.2 V 288 (1G x 8) x 8 EOL announced.

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      DDR4 UDIMM 8 GB 1R x 8 2133 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

    • M378A1K43CB2-CRC

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2400 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

    • M378A1K43CB2-CTD

      Samsung Semiconductor

      DDR4 UDIMM 8 GB 1R x 8 2666 Mbps 1.2 V 288 (1G x 8) x 8 Mass Production.

    Nga Wahanga Panu