A15896-03 Utu (USD) [1295Stock Ngahau]
- 1 pcs$33.59144
- 5 pcs$33.42432
- Te waahanga waahanga:
- A15896-03
- Kaihanga:
- Laird Technologies - Thermal Materials
- Whakaahuatanga Taipitopito:
- THERM PAD 228.6MMX228.6MM GRAY. Thermal Interface Products Tflex 730 9x9" 5.0W/mK gap filler
- Ko te wa kaiarahi paerewa a te kaihanga:
- I roto i te taonga
- Te whare noho:
- Kotahi Tau
- Chip Mai:
- Hong Kong
- RoHS:
- Te tikanga utu:
-
- Te ara kaipuke:
- Ngā Kāwai Whānau:
- KEY Components Co, Ko te LTD he Kaiwhakarite Taonga Hiko e tuku ana i nga waahanga hua tae atu ki: Ahua AC, Te Raumati - Pads, Rau, Te wera - Te waipiro, Te Werawera - Thermoelectric, Peltier Modules, Utu - Taonga, Te Raumati - Maamaa, Epoxies, Kariki, Pahi, Te Raumati - Thermoelectric, Peltier Assemblies and DC Fans ...
- Whakapai Tinana:
- We specialize in Laird Technologies - Thermal Materials A15896-03 electronic components. A15896-03 can be shipped within 24 hours after order. If you have any demands for A15896-03, Please submit a Request for Quotation here or send us an email: rfq@key-components.com
A15896-03 Nga Hua Hua
Te waahanga waahanga :
A15896-03
Kaihanga :
Laird Technologies - Thermal Materials
Whakaahuatanga :
THERM PAD 228.6MMX228.6MM GRAY
Toa :
Tflex™ 700
Wāhanga wahi :
Not For New Designs
Whakamahi :
-
Momo :
Gap Filler Pad, Sheet
Hanga :
Square
Rarangi :
228.60mm x 228.60mm
Paruparu :
0.0300" (0.762mm)
Ahumahi :
Silicone
Whakapiri :
Tacky - Both Sides
Te tuuri, kawe :
-
Tae :
Gray
Whanatau Whakahohaetanga :
-
Te Whanonga Haumaru :
5.0 W/m-K
Nga Pūrongo Hou
Kia Korero Ma Te Korero
-
PL-2-1-254
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GRAY. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 1 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Grey
-
CD-02-05-264
Wakefield-Vette
THERM PAD 26.67MMX21.59MM ORANGE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-264 Pad, 0.003 Inch Thick
-
CD-02-05-C-18
Wakefield-Vette
THERM PAD 0.689 X 0.689. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Chipset Pad 0.689 Inch x 0.689 Inch, No Hole
-
CD-02-05-126
Wakefield-Vette
THERM PAD TO-126 PAD WITH HOLE. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, TO-126 Pad with Hole
-
CD-02-05-REC-125-N
Wakefield-Vette
THERM PAD RECT 1.25 X 1.25. Thermal Interface Products ulTIMiFlux Dielectric Phase Change Thermal Material, Rectifier Pad 1.25 Inch x 1.25 Inch, No Hole
-
PL-2-5-254-H
Wakefield-Vette
THERM PAD 25.4MMX25.4MM GOLD. Thermal Interface Products ulTIMiFlux Thermal Gap Filling Pad, 5 W/m K Silicone Gap Filler, 2.0mm Thickness, 25.4x25.4mm, Gold, Hyper Soft
Nga Wahanga Panu
- A14574-01
- A15996-08
- A14950-17
- A15896-07
- A14950-16
- A15996-05
- A14950-06
- GP3000S30-0.060-02-0816-NA
- GP1500-0.200-02-0816
- DC0041/03-PC99-0.06
- DC0037/03-PC99AL-0.1
- DC0037/01-PC99-0.06
- DC0040/05-PC99AL-0.1
- DC0037/03-PC99-0.06
- DC0039/06-PC99AL-0.1
- DC0041/04-PC99-0.06
- DC0039/05-PC99AL-0.1
- TG4040S-100-100-2.0-0
- TG4040S-300-300-1.0-0
- TG2030S-100-100-1.0-0
- 5592S
- TG4040S-300-300-5.0-0
- T68-2B-120-90-0.04
- PC93-20-20-5
- PC99-150-150-0.12-0
- A16365-14
- A16365-10
- A16365-06
- A14162-29
- 5591S 210 MM X 300 MM 2.0 MM
- 5591S 210 MM X 300 MM 2.5 MM
- 5591S 210 MM X 300 MM 1.5 MM
- 5591S 210 MM X 300 MM 1.0 MM
- CPU .63X.63
- DC0039/03-PC99AL-0.1
- DC0039/02-PC99-0.06
- TG2030S-300-300-1.0-0
- A14162-37
- SP400-0.007-00-17
- Q3-0.005-00-22